公开(公告)号：US20180215154A1

公开(公告)日：2018-08-02

申请号：US15748844

申请日：2015-10-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Silam J. CHOY

IPC: B41J2/155 ,  B41J2/045 ,  B41J3/407

Abstract: In one example in accordance with the present disclosure a flexible printhead is described. The printhead includes a number of printhead die, a printhead die including a number of nozzles to deposit an amount of fluid onto a print medium. The printhead also includes a fluid delivery system to deliver the amount of fluid from a fluid supply to the number of nozzles. The printhead also includes a number of electrical circuits to electronically couple the number of printhead die with a printing device. The printhead also includes a flexible substrate on which the number of printhead die and the number of electrical circuits are mounted.

公开(公告)号：US20190076837A1

公开(公告)日：2019-03-14

申请号：US16085253

申请日：2016-03-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jeffrey A. NIELSEN ,  Michael W. CUMBIE ,  Devin Alexander MOUREY ,  Silam J. CHOY ,  Kenneth WARD ,  Christie DUDENHOEFER

IPC: B01L3/02

Abstract: A digital dispense apparatus includes at least one fluid dispense device, at least one reservoir fluidically connected to the at least one fluid dispense device, a monolithic carrier structure carrying the at least one fluid dispense device and reservoir, the monolithic carrier forming fluid routing between the reservoir and the fluid dispense device.

公开(公告)号：US20180222194A1

公开(公告)日：2018-08-09

申请号：US15749073

申请日：2015-10-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua CHEN ,  Michael W. CUMBIE ,  Silam J. CHOY

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14072 ,  B41J2/155 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1635 ,  B41J2/1637 ,  B41J2202/20

Abstract: A printhead includes a moldable substrate, and a number of printhead dies molded into the moldable substrate. The printhead dies include a number of printhead dies molded into the moldable substrate. The dies comprise a non-rectangular shape. A number of fluid slots are defined in the moldable substrate to fluidically coupled to the printhead dies to feed fluid to the printhead dies. The number of fluid slots is not equal to the number of printhead dies.

公开(公告)号：US20220297113A1

公开(公告)日：2022-09-22

申请号：US17836005

申请日：2022-06-09

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jeffrey A. NIELSEN ,  Michael W. CUMBIE ,  Devin Alexander MOUREY ,  Silam J. CHOY ,  Kenneth WARD ,  Christie DUDENHOEFER

IPC: B01L3/02

Abstract: A method of manufacturing a digital dispense apparatus includes molding a monolithic carrier structure, forming cut outs into a planar top surface of the monolithic carrier structure, the cut outs including a reservoir extending into part of a thickness of the monolithic carrier structure and fluid routing to connect the reservoir with a fluid dispense device, and overmolding the fluid dispense device into the monolithic carrier structure on a side of the monolithic carrier structure that is opposite to the reservoir to fluidically connect to the fluid routing.

公开(公告)号：US20210229094A1

公开(公告)日：2021-07-29

申请号：US17049987

申请日：2019-05-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Silam J. CHOY ,  Hilary ELY

IPC: B01L3/00

Abstract: A microfluidic device includes a microfluidic chamber fluidly coupled to an inlet port and an outlet port, a semiconductor microchip including fluid active circuitry and transistor circuitry, and a bed of solid supports positioned within the microfluidic chamber fluidly positioned between the inlet port and the outlet port. The transistor circuitry in this example provides onboard logic at the semiconductor microchip to control fluid active circuitry. The semiconductor microchip also defines a portion of the microfluidic chamber.

公开(公告)号：US20190083972A1

公开(公告)日：2019-03-21

申请号：US16085342

申请日：2016-03-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jeffrey A. NIELSEN ,  Michael W. CUMBIE ,  Devin Alexander MOUREY ,  Silam J. CHOY ,  Christie DUDENHOEFER ,  Kenneth WARD

IPC: B01L3/02 ,  B01J19/00 ,  B41J2/175 ,  B41J2/14 ,  B41J2/155

Abstract: A digital dispense apparatus comprising a plurality of fluid dispense devices, at least one reservoir connected to the plurality of fluid dispense devices to deliver fluid to the plurality of fluid dispense devices, at least one contact pad array, and a single monolithic carrier structure.