Abstract:
In one example in accordance with the present disclosure, a fluid ejection device assembly is described. The fluid ejection device assembly includes a monolithically molded fluidic structure to extend between a separately molded body comprising a print fluid reservoir and a fluid ejection device. The fluidic structure includes a plenum to receive a print fluid from the body at a fluidic interface.
Abstract:
A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.
Abstract:
An integrated circuit to drive a plurality of fluid actuation devices includes a configuration register, a plurality of interfaces, and control logic. The plurality of interfaces include a mode interface and a data interface. The control logic enables writing to the configuration register in response to a signal on the mode interface transitioning to logic high with a logic high signal on the data interface.
Abstract:
A logic circuit for a replaceable print component is configured to, in response to a plurality of commands including a first command specifying the new I2C communications address and a first calibration parameter, a second command specifying the new I2C communications address and a second calibration parameter, a third command specifying the new I2C communications address and a class parameter, and/or fourth commands specifying the new I2C communications address and sub-class parameters, and at least one read request, generate count values in a count value range defined by a highest and lowest count value.
Abstract:
In example implementations, an apparatus with an embedded service structure is provided. The apparatus may include an epoxy molded compound (EMC). At least one print head die may be embedded in the EMC. A service structure may be located within the EMC adjacent to the at least one print head die.
Abstract:
According to an example, a printing system may include a drop ejecting element and a fluid circulating element corresponding to the drop ejecting element. The printing system may also include a logic device that is to receive a data stream addressed to the drop ejecting element, determine whether the data stream indicates that the drop ejecting element is to be energized, and in response to a determination that the data stream does not indicate that the drop ejecting element is to be energized, energize the fluid circulating element.
Abstract:
Examples of fluid ejection apparatuses and methods for making fluid ejection apparatuses are described. An example method may include forming a fluid feed slot in a bulk layer of a substrate, forming a plurality of ink feed channels in at least an epitaxial layer of the substrate, each of the ink feed channels fluidically coupled to the fluid feed slot, and forming a plurality of drop generators over the substrate such that the epitaxial layer of the substrate is between the plurality of drop generators and the bulk layer and such that the each of the drop generators is fluidically coupled to the fluid feed slot by at least one of the ink feed channels.
Abstract:
A method of manufacturing a digital dispense apparatus includes molding a monolithic carrier structure, forming cut outs into a planar top surface of the monolithic carrier structure, the cut outs including a reservoir extending into part of a thickness of the monolithic carrier structure and fluid routing to connect the reservoir with a fluid dispense device, and overmolding the fluid dispense device into the monolithic carrier structure on a side of the monolithic carrier structure that is opposite to the reservoir to fluidically connect to the fluid routing.
Abstract:
A logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit, and at least one logic circuit. The logic circuit may be configured to identify, from a command stream received from the print apparatus, parameters including a class parameter, and/or identify, from the command stream, a read request, and output, via the interface, a count value in response to a read request, the count value based on identified received parameters.
Abstract:
A fluid ejection device may include fluid actuators, ejection chambers adjacent the fluid actuators, nozzles extending from the ejection chambers, and fluid feed holes to supply fluid from a fluid supply passage to the ejection chambers. The fluid feed holes have ports connected to the ejection chambers. The ports are sized to pass bubbles formed by the fluid actuators out of the ejection chambers.