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    REDUCING CAKING OF BUILD MATERIAL
    1.
    发明申请
    REDUCING CAKING OF BUILD MATERIAL 有权

    公开(公告)号：US20220072768A1

    公开(公告)日：2022-03-10

    申请号：US17417993

    申请日：2019-05-29

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Stan E. Leigh ,  Karsten N. Wilson ,  Anthony Holden

    IPC: B29C64/153 ,  B29C64/205 ,  B29C64/264 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

    Abstract: According to one aspect, there is provided a method of selectively solidifying successive layers of build material in a 3D printing system. The method comprises obtaining data relating to a 3D object to be generated, forming a layer of build material on a build platform, applying to the formed layer a pattern of fusing agent corresponding to a portion of the layer to be solidified to form a layer of the object, applying to the formed layer a pattern of anti-caking agent on portions of the formed layer that are not to be solidified to form a layer of the object, and applying energy to the whole of the formed layer to cause portions of the layer on which fusing agent was applied to heat up, melt, coalesce, and then solidify upon cooling, and to cause portions of the formed layer on which anti-caking agent was applied to control caking of build material in those portions.

    FLUIDIC DIES WITH BEVELED EDGES UNDERNEATH ELECTRICAL LEADS
    2.
    发明申请
    FLUIDIC DIES WITH BEVELED EDGES UNDERNEATH ELECTRICAL LEADS 有权

    公开(公告)号：US20210170746A1

    公开(公告)日：2021-06-10

    申请号：US16760923

    申请日：2018-01-23

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Stan E. Leigh ,  Kellie Susanne Jensen ,  Terry McMahon ,  Donald W. Schulte

    IPC: B41J2/14 ,  B41J2/175

    Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a surface on which a number of nozzles are formed. An electrical interface on the fluidic die establishes an electrical connection between the fluidic die and a fluidic die controller. The electrical interface includes 1) a bond pad disposed within a bond pad region of the surface and 2) an electrical lead coupled to the bend pad to establish an electrical connection between the fluidic die and the fluidic die controller. The fluidic die also includes a beveled edge along an edge of the surface underneath the electrical lead.

    THERMAL INKJET PRINTHEAD
    8.
    发明申请
    THERMAL INKJET PRINTHEAD 有权
    热喷墨打印头

    公开(公告)号：US20160339703A1

    公开(公告)日：2016-11-24

    申请号：US15114008

    申请日：2014-01-29

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Stan E. Leigh ,  Terry Mcmahon ,  Tom P. Abdilla

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14427 ,  B41J2/14072 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2/1648

    Abstract: A thermal inkjet printhead is described. The thermal inkjet printhead comprising a passivation layer and a plurality of bond pads formed over the passivation layer. The thermal inkjet printhead further comprises a plurality of insulating strips formed over the passivation layer. The insulating strips are formed such that two adjacent bond pads are separated by an insulating strip, from among the plurality of insulating strips. Further, each of the plurality of the insulating strips is of a dielectric material.

    Abstract translation: 描述热喷墨打印头。 热喷墨打印头包括钝化层和形成在钝化层上的多个接合焊盘。 热喷墨打印头还包括形成在钝化层上的多个绝缘条。 绝缘条形成为使得两个相邻的接合焊盘由绝缘条从多个绝缘条之间分离。 此外，多个绝缘条中的每一个都是电介质材料。

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