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    Pattern Evaluation Apparatus and Computer Program
    2.
    发明申请
    Pattern Evaluation Apparatus and Computer Program 审中-公开

    公开(公告)号：US20200033122A1

    公开(公告)日：2020-01-30

    申请号：US16337694

    申请日：2017-08-04

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Yasutaka TOYODA ,  Hiroyuki SHINDO

    IPC: G01B15/04

    Abstract: The present invention is intended to provide a pattern evaluation apparatus and a computer program aimed at achieving defect inspection with high efficiency and high precision while allowing manufacturing variations that are dissimilar depending on the sites of a circuit. In order to achieve the above object, proposed are a computer program and an inspection system having a means of performing statistical processing of measurement data of a plurality of inspection target patterns having similar or same design pattern shape used for manufacturing the inspection target patterns, and performing adjustment of a defect determination threshold in accordance with a distribution state of measurement data.

    PATTERN INSPECTION SYSTEM
    3.
    发明申请
    PATTERN INSPECTION SYSTEM 有权

    公开(公告)号：US20210383524A1

    公开(公告)日：2021-12-09

    申请号：US17410344

    申请日：2021-08-24

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Shuyang DOU ,  Shinichi SHINODA ,  Yasutaka TOYODA ,  Hiroyuki SHINDO

    IPC: G06T7/00 ,  G06T7/73 ,  G06T7/13 ,  G06T7/80 ,  G06N20/00 ,  G06T7/11

    Abstract: A pattern inspection system inspects an image of an inspection target pattern of an electronic device using an identifier constituted by machine learning, based on the image of the inspection target pattern of the electronic device and data used to manufacture the inspection target pattern. The system includes a storage unit which stores a plurality of pattern images of the electronic device and pattern data used to manufacture a pattern of the electronic device, and an image selection unit which selects a learning pattern image used in the machine learning from the plurality of pattern images, based on the pattern data and the pattern image stored in the storage unit.

    PATTERN INSPECTION SYSTEM
    4.
    发明申请
    PATTERN INSPECTION SYSTEM 审中-公开

    公开(公告)号：US20200074611A1

    公开(公告)日：2020-03-05

    申请号：US16557175

    申请日：2019-08-30

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Shuyang DOU ,  Shinichi SHINODA ,  Yasutaka TOYODA ,  Hiroyuki SHINDO

    IPC: G06T7/00 ,  G06T7/73 ,  G06T7/13 ,  G06T7/80 ,  G06T7/11 ,  G06N20/00

    Abstract: A pattern inspection system inspects an image of an inspection target pattern of an electronic device using an identifier constituted by machine learning, based on the image of the inspection target pattern of the electronic device and data used to manufacture the inspection target pattern. The system includes a storage unit which stores a plurality of pattern images of the electronic device and pattern data used to manufacture a pattern of the electronic device, and an image selection unit which selects a learning pattern image used in the machine learning from the plurality of pattern images, based on the pattern data and the pattern image stored in the storage unit.

    Pattern Shape Evaluation Device and Method
    5.
    发明申请
    Pattern Shape Evaluation Device and Method 有权
    图案形状评估装置及方法

    公开(公告)号：US20160189368A1

    公开(公告)日：2016-06-30

    申请号：US14898973

    申请日：2014-05-07

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Hiroyuki SHINDO

    IPC: G06T7/00

    CPC classification number: G06T7/0006 ,  G01N2223/6113 ,  G06T7/001 ,  G06T7/13 ,  G06T2207/10016 ,  G06T2207/10061 ,  G06T2207/10144 ,  G06T2207/30148 ,  H01J37/222 ,  H01J37/28 ,  H01L22/12

    Abstract: In order to enable the computation of a process window including an arbitrary exposure condition, the present invention comprises: a contour data extraction means for extracting contour data from captured images of a plurality of circuit patterns formed by altering exposure conditions for identical design layouts; a shape variation measurement means for measuring, on the basis of the plurality of sets of extracted contour data, the amount of shape deformation at each edge or local region of the circuit patterns; a variation model computation means for computing, on the basis of the measured amount of shape deformation, a variation model for the contour data of a circuit pattern or a shape corresponding to a prescribed exposure condition; and a process window computation means using the variation model to estimate the amount of shape variation of a circuit pattern or a shape corresponding to an arbitrary exposure condition with respect to a circuit pattern or a shape corresponding to an exposure condition specified by a reference exposure condition and compute a process window on the basis of the estimated amount of shape variation.

    Abstract translation: 为了能够计算包括任意曝光条件的处理窗口，本发明包括：轮廓数据提取装置，用于从通过改变相同设计布局的曝光条件而形成的多个电路图形的拍摄图像中提取轮廓数据; 形状变化测量装置，用于根据多组提取的轮廓数据，测量电路图案的每个边缘或局部区域处的形状变形量; 变化模型计算装置，用于根据所测量的形状变形量计算电路图形的轮廓数据或对应于规定的曝光条件的形状的变化模型; 以及处理窗口计算装置，使用所述变化模型来估计与根据由参考曝光条件指定的曝光条件相对应的电路图形或形状对应于任意曝光条件的电路图案或形状的形状变化量 并基于估计的形状变化量来计算处理窗口。

    Image Evaluation Method and Image Evaluation Device
    6.
    发明申请
    Image Evaluation Method and Image Evaluation Device 审中-公开

    公开(公告)号：US20190228522A1

    公开(公告)日：2019-07-25

    申请号：US16252061

    申请日：2019-01-18

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Shinichi SHINODA ,  Masayoshi ISHIKAWA ,  Yasutaka TOYODA ,  Yuichi ABE ,  Hiroyuki SHINDO

    IPC: G06T7/00 ,  G06N20/00 ,  G06K9/20 ,  G06K9/03

    Abstract: The image evaluation device includes a design data image generation unit that images design data; a machine learning unit that creates a model for generating a design data image from an inspection target image, using the design data image as a teacher and using the inspection target image corresponding to the design data image; a design data prediction image generation unit that predicts the design data image from the inspection target image, using the model created by the machine learning unit; a design data image generation unit that images the design data corresponding to the inspection target image; and a comparison unit that compares a design data prediction image generated by the design data prediction image generation unit and the design data image. As a result, it is possible to detect a systematic defect without using a defect image and generating misinformation frequently.

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