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    X-RAY INSPECTION APPARATUS
    1.
    发明申请
    X-RAY INSPECTION APPARATUS 审中-公开

    公开(公告)号：US20180252656A1

    公开(公告)日：2018-09-06

    申请号：US15899495

    申请日：2018-02-20

    Applicant: Shimadzu Corporation

    Inventor： Goro KAMBE

    IPC: G01N23/04

    CPC classification number: G01N23/043 ,  G01N23/083 ,  G01N2223/3307 ,  G01N2223/6113 ,  G01N2223/6116

    Abstract: An X-ray inspection apparatus includes an X-ray source, an X-ray detector, and a stage. A dose rate calculation unit of a control section calculates a dose rate at any position in an inspection space, a stage face information storage unit 32 stores stage face information, an irradiation history monitoring unit monitors a movement locus, a stage face cumulative irradiation dose calculation unit calculates cumulative irradiation dose distribution data, a stage face imaging range calculation unit calculates a stage face imaging range of the X-ray detector, and a dose distribution image display control unit extracts the cumulative irradiation dose distribution data in an imaging range and displays an image thereof.

    Pattern shape evaluation device and method
    2.
    发明授权
    Pattern shape evaluation device and method 有权

    公开(公告)号：US09679371B2

    公开(公告)日：2017-06-13

    申请号：US14898973

    申请日：2014-05-07

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Hiroyuki Shindo

    IPC: G06K9/00 ,  G06T7/00 ,  H01J37/22 ,  G06T7/13 ,  H01J37/28 ,  H01L21/66

    CPC classification number: G06T7/0006 ,  G01N2223/6113 ,  G06T7/001 ,  G06T7/13 ,  G06T2207/10016 ,  G06T2207/10061 ,  G06T2207/10144 ,  G06T2207/30148 ,  H01J37/222 ,  H01J37/28 ,  H01L22/12

    Abstract: In order to enable the computation of a process window including an arbitrary exposure condition, the present invention comprises: a contour data extraction means for extracting contour data from captured images of a plurality of circuit patterns formed by altering exposure conditions for identical design layouts; a shape variation measurement means for measuring, on the basis of the plurality of sets of extracted contour data, the amount of shape deformation at each edge or local region of the circuit patterns; a variation model computation means for computing, on the basis of the measured amount of shape deformation, a variation model for the contour data of a circuit pattern or a shape corresponding to a prescribed exposure condition; and a process window computation means using the variation model to estimate the amount of shape variation of a circuit pattern or a shape corresponding to an arbitrary exposure condition with respect to a circuit pattern or a shape corresponding to an exposure condition specified by a reference exposure condition and compute a process window on the basis of the estimated amount of shape variation.

    Radiation image acquisition system
    3.
    发明授权
    Radiation image acquisition system 有权
    辐射图像采集系统

    公开(公告)号：US09500600B2

    公开(公告)日：2016-11-22

    申请号：US14415273

    申请日：2013-06-18

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Mototsugu Sugiyama ,  Toshiyasu Suyama

    IPC: G01N23/04 ,  G01T1/20

    CPC classification number: G01N23/04 ,  G01N2223/33 ,  G01N2223/3306 ,  G01N2223/3308 ,  G01N2223/424 ,  G01N2223/505 ,  G01N2223/6113 ,  G01N2223/6116 ,  G01T1/20

    Abstract: A radiation image acquisition system of an aspect of the present invention includes a radiation source emitting radiation toward an object, a holding unit holding the object, a wavelength conversion member generating scintillation light in response to incidence of the radiation emitted from the radiation source and transmitted through the object, a first imaging means condensing and imaging scintillation light emitted from an incidence surface of the radiation of the wavelength conversion member, a second imaging means condensing and imaging scintillation light emitted from a surface opposite to the incidence surface of the wavelength conversion member, a holding unit position adjusting means adjusting the position of the holding unit between the radiation source and the wavelength conversion member, and an imaging position adjusting means adjusting the position of the first imaging means.

    Abstract translation: 本发明的一个方面的放射线图像采集系统包括：朝向物体发射辐射的辐射源，保持物体的保持单元，响应于从辐射源发射的辐射的入射产生闪烁光的波长转换部件， 通过该目的，第一成像装置冷凝并成像从波长转换部件的辐射的入射表面发射的闪烁光，第二成像装置，将从与波长转换部件的入射面相反的表面发射的闪烁光成像， 调节所述保持单元在所述辐射源与所述波长转换构件之间的位置的保持单元位置调整装置，以及调整所述第一成像装置的位置的成像位置调节装置。

    METHOD AND A SYSTEM FOR RECOGNIZING VOIDS IN A BUMP
    4.
    发明申请
    METHOD AND A SYSTEM FOR RECOGNIZING VOIDS IN A BUMP 有权
    用于识别BUMP中的声音的方法和系统

    公开(公告)号：US20140161224A1

    公开(公告)日：2014-06-12

    申请号：US14234169

    申请日：2012-09-02

    Applicant: MICHA Geffen ,  Doron Reinis

    Inventor： MICHA Geffen ,  Doron Reinis

    IPC: G01N23/22 ,  G01R31/26

    CPC classification number: G01N23/22 ,  G01N23/2252 ,  G01N2223/6113 ,  G01R31/26

    Abstract: A method and a system for bump's inspection are disclosed. The inspection done by comparing the volume of the bump's outside contour and the volume the solid materials from which the bump is made and/or analyzing the bump's solid materials ratio. Principally, the inspection id done by preparing an empiric reference table of the emitted energy received from the solid materials, from which a reference proper bump with a given volume is comprised, using ED-XRF (Energy-Dispersive-X-ray-Fluorescence analysis) analyze; obtaining a first calculated volume of the bump, using a 3D image-processing method; adapting the reference table according to the difference between the given volume and the first calculated volume of the bump; performing a second volume calculation of the bump by applying ED-XRF technology. The difference between the first and second volume calculations and the solid material combination are used to inspect the bump.

    Abstract translation: 公开了一种用于凸块检查的方法和系统。 通过比较凸块的外部轮廓的体积和制造凸块的固体材料和/或分析凸块的固体材料比来进行检查。 主要是通过使用ED-XRF（能量 - 分散X射线 - 荧光分析法）制备从固体材料接收的发射能量的经验参考表，其中包括具有给定体积的参考适当凸块 ）分析; 使用3D图像处理方法获得凸起的第一计算体积; 根据给定体积与凸起的第一计算体积之间的差异来适应参考表; 通过应用ED-XRF技术对凸点进行第二次体积计算。 第一和第二体积计算和固体材料组合之间的差异用于检查凸块。

    X-ray fluorescence analyzer
    9.
    发明授权
    X-ray fluorescence analyzer 有权

    公开(公告)号：US09810649B2

    公开(公告)日：2017-11-07

    申请号：US14956370

    申请日：2015-12-01

    Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

    Inventor： Toshiyuki Takahara ,  Hiroyuki Noda ,  Ai Masuda

    IPC: G01N23/22 ,  G01N23/207 ,  G01N23/223 ,  G21F3/00

    CPC classification number: G01N23/223 ,  G01N2223/076 ,  G01N2223/30 ,  G01N2223/6113 ,  G21F3/00

    Abstract: An X-ray fluorescence analyzer includes: a sample stage having a mounting surface on which a sample on which a sample is mounted is mounted; an X-ray source configured to irradiate the sample with primary X-rays and disposed immediately above an irradiation position of the sample; a detector configured to detect fluorescent X-rays emitted from the sample irradiated with the primary X-rays; and a shielding container configured to accommodate the sample stage, the X-ray source, and the detector and includes: a sample chamber configured to accommodate the sample stage; and a door provided at a top of the sample chamber and configured to open and close at least a front half of the sample chamber, wherein the X-ray source and the detector are disposed at a rear half of the sample chamber.

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