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Patent Agency Ranking
公开(公告)号：US20210013154A1
公开(公告)日：2021-01-14
申请号：US17038756
申请日：2020-09-30
Applicant: Huawei Technologies Co., Ltd.
Inventor： Wei Wu , Ding Li , Hongcheng Yin , Xiongcai Kuang
IPC: H01L23/552 , H01L23/00
Abstract: A flip-chip die package includes a substrate, a die, a plurality of conductive bumps, and a first metal structure, where an upper surface of the die is electrically coupled, using the conductive bumps, to a surface that is of the substrate and that faces the die, and the first metal structure includes a plurality of first metal rods disposed between the substrate and the die, where each first metal rod is electrically coupled to the substrate and the die, and the first metal rods are arranged around a first active functional circuit, and the first active functional circuit includes an electromagnetic radiation capability or an electromagnetic receiving capability in the die.
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公开(公告)号：US11489247B2
公开(公告)日：2022-11-01
申请号：US17150365
申请日：2021-01-15
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Weixi Zhou , Ming Chang , Hailin Dong , Liangsheng Liu , Hongcheng Yin
Abstract: Embodiments of this application disclose an integrated circuit and a terminal device, to resolve a problem that an existing dual-band antenna has a relatively small low-frequency band range and is difficult to meet use requirements. An antenna includes a bearer structure, a first radiation patch, a second radiation patch, and a radio frequency processing chip. The first radiation patch, the second radiation patch, and the radio frequency processing chip are separately placed on different layers of the bearer structure. A first feed line and a second feed line are disposed in the bearer structure. The radio frequency processing chip feeds the first radiation patch by using the first feed line. The radio frequency processing chip feeds the second radiation patch by using the second feed line.
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公开(公告)号：US20210043998A1
公开(公告)日：2021-02-11
申请号：US17079997
申请日：2020-10-26
Applicant: Huawei Technologies Co., Ltd.
Inventor： Heng Qu , Ming Chang , Hailin Dong , Xinhong Li , Liangsheng Liu , Hongcheng Yin
Abstract: A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.
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公开(公告)号：US11462817B2
公开(公告)日：2022-10-04
申请号：US17079997
申请日：2020-10-26
Applicant: Huawei Technologies Co., Ltd.
Inventor： Heng Qu , Ming Chang , Hailin Dong , Xinhong Li , Liangsheng Liu , Hongcheng Yin
Abstract: A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.
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公开(公告)号：US11251136B2
公开(公告)日：2022-02-15
申请号：US17038756
申请日：2020-09-30
Applicant: Huawei Technologies Co., Ltd.
Inventor： Wei Wu , Ding Li , Hongcheng Yin , Xiongcai Kuang
IPC: H01L23/552 , H01L23/00
Abstract: A flip-chip die package includes a substrate, a die, a plurality of conductive bumps, and a first metal structure, where an upper surface of the die is electrically coupled, using the conductive bumps, to a surface that is of the substrate and that faces the die, and the first metal structure includes a plurality of first metal rods disposed between the substrate and the die, where each first metal rod is electrically coupled to the substrate and the die, and the first metal rods are arranged around a first active functional circuit, and the first active functional circuit includes an electromagnetic radiation capability or an electromagnetic receiving capability in the die.
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