VOLTAGE SCALING METHOD AND ELECTRONIC DEVICE

    公开(公告)号:US20220300064A1

    公开(公告)日:2022-09-22

    申请号:US17834710

    申请日:2022-06-07

    Abstract: This application discloses a voltage scaling method and an electronic device. The method is applied to an electronic device having a processor and a power supply that supplies power to the processor. The method includes the processor sending power supply scaling information to the power supply based on an operating frequency in a next time period. The method further includes the power supply determining, based on the power supply scaling information, a supply voltage Vout used to supply power to the processor. The supply voltage Vout decreases as a load current of the power supply increases. Vmin≤Vout≤V, where Vmin is a lowest supply voltage of the processor at the operating frequency in the next time period, and V is a specified supply voltage of the processor at the operating frequency in the next time period.

    MEMORY TRAINING METHOD, MEMORY CONTROLLER, PROCESSOR, AND ELECTRONIC DEVICE

    公开(公告)号:US20230244617A1

    公开(公告)日:2023-08-03

    申请号:US18192019

    申请日:2023-03-29

    CPC classification number: G06F13/1689

    Abstract: This application provides a memory training method, a memory controller, a processor, and an electronic device. The memory controller keeps transmission delays of N DQs unchanged, adjusts a transmission delay of a DQS, and determines a maximum DQS transmission delay and/or a minimum DQS transmission delay of the DQS when all data carried in the N DQs is correctly transmitted. The memory controller adjusts the transmission delay of the DQS to a target DQS transmission delay between the maximum DQS transmission delay and the minimum DQS transmission delay. The method helps quickly align relative timing positions between the DQS and the N DQs. Therefore, memory training may be repeatedly performed in a working process of the processor, so that the N DQs keep enough timing margins.

    ELECTRONIC MODULE AND ELECTRONIC DEVICE

    公开(公告)号:US20220330417A1

    公开(公告)日:2022-10-13

    申请号:US17852581

    申请日:2022-06-29

    Abstract: This application provides an electronic module and an electronic device. The electronic module includes a first component, a second component, and a plurality of terminals. The first component includes a package substrate and a chip mounted on the package substrate. The second component includes a circuit board and a mount base mounted on the circuit board. Each terminal includes a body part, and a first bent part and a solder ball that are respectively connected to two opposite ends of the body part. In each terminal, the body part passes through and is fastened to the mount base, the first bent part presses against a corresponding first solder pad on the package substrate, and the solder ball is connected to a corresponding second solder pad on the circuit board.

Patent Agency Ranking