Method Of Laminating Adherend
    4.
    发明申请
    Method Of Laminating Adherend 审中-公开
    层压被粘物的方法

    公开(公告)号:US20080196822A1

    公开(公告)日:2008-08-21

    申请号:US12063564

    申请日:2006-08-08

    IPC分类号: B29C65/02

    摘要: There is provided a means for laminating and bonding a flexible printed circuit and a stiffener film with an adhesive layer therebetween by using a laminator without creating air bubbles at the lamination surface and without using large-scale manufacturing equipment. A method comprising: providing a laminate in which liners are on upper and lower surfaces of a half-cured reactive adhesive layer (3), removing one of the liners from the laminate, and bonding a surface of a first adherend (2) to the first exposed surface of the adhesive layer; removing the other liner from the laminate, pressure bonding a minute embossing pattern (4) surface of an embossed liner to the second exposed surface of the adhesive layer to form a minute embossing pattern on the surface of the adhesive layer; and removing the embossed liner from the surface of the adhesive layer, and thermocompression bonding a second adherend to the surface of the adhesive layer having the minute embossing pattern.

    摘要翻译: 提供了一种用于通过使用层压机在其间具有粘合剂层的柔性印刷电路和加强膜的层压和接合的装置,而不在层压表面上产生气泡并且不使用大规模制造设备。 一种方法,包括:提供层叠体,其中衬垫位于半固化的反应性粘合剂层(3)的上表面和下表面上,从层压体中去除一个衬垫,并将第一粘附体(2)的表面粘合到 粘合剂层的第一暴露表面; 从层压体中除去另一个衬垫,将压花衬垫的微小压花图案(4)表面压粘到粘合剂层的第二暴露表面上,以在粘合剂层的表面上形成微小的压花图案; 从粘合剂层的表面除去压纹衬垫,并将第二被粘物热压到具有微小压花图案的粘合剂层的表面上。