公开(公告)号：US08771828B2

公开(公告)日：2014-07-08

申请号：US12299714

申请日：2008-01-24

申请人： Hiroyuki Kawakami ,  Katsuyasu Niijima ,  Naoki Tomori ,  Daichi Takemori ,  Takuya Imai

发明人： Hiroyuki Kawakami ,  Katsuyasu Niijima ,  Naoki Tomori ,  Daichi Takemori ,  Takuya Imai

IPC分类号： H01L23/28 ,  B32B27/38 ,  B32B27/20 ,  C08K3/36 ,  H01L23/29 ,  C08G59/62 ,  C08L63/00 ,  C08K3/00

CPC分类号： H01L23/293 ,  C08G59/621 ,  C08K3/013 ,  C08L63/00 ,  C08L2666/54 ,  C08L2666/72 ,  H01L23/28 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/24967 ,  Y10T428/25 ,  Y10T428/26 ,  Y10T428/31511 ,  H01L2924/00

摘要： A sealing film which includes a resin layer having a flow within the range of 150 to 1800 μm at 80° C., or having a resin layer with a viscosity within the range of 10000 to 100000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of −50 to 50° C., and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 μm, and (C) a colorant, as well as a manufacturing method thereof and a semiconductor device using the same.

摘要翻译： 一种密封膜，其包括在80℃下流动范围为150〜1800μm的树脂层，或者在B阶段具有粘度在10000〜100000Pa·s的树脂层的树脂层 50〜100℃的热固性粘弹性测定中，含有：（A）包含（a1）包含交联官能团的高分子量成分，重均分子量为100,000以上，Tg在该范围内 为-50〜50℃，（a2）以环氧树脂为主要成分的热固性成分，（B）平均粒径为1〜30μm的填料，（C）着色剂 ，以及其制造方法和使用该方法的半导体器件。

公开(公告)号：US20090189300A1

公开(公告)日：2009-07-30

申请号：US12299714

申请日：2008-01-24

申请人： Hiroyuki Kawakami ,  Katsuyasu Niijima ,  Naoki Tomori ,  Daichi Takemori ,  Takuya Imai

发明人： Hiroyuki Kawakami ,  Katsuyasu Niijima ,  Naoki Tomori ,  Daichi Takemori ,  Takuya Imai

IPC分类号： H01L23/28 ,  B32B27/20 ,  B05D7/08 ,  C08K3/36

CPC分类号： H01L23/293 ,  C08G59/621 ,  C08K3/013 ,  C08L63/00 ,  C08L2666/54 ,  C08L2666/72 ,  H01L23/28 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/24967 ,  Y10T428/25 ,  Y10T428/26 ,  Y10T428/31511 ,  H01L2924/00

摘要： The present invention provides a sealing film excellent in filling properties and adhesiveness as a sealing film which comprises a resin layer containing the following (A), (B) and (C) and having a flow within the range of 150 to 1800 μm at 80° C.: (A) a resin component containing (a1) a high-molecular-weight component comprising crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of −50 to 50° C. and (a2) a thermoplastic component comprising an epoxy resin as main component, (B) a filler having an average particle size within the range of 1 to 30 μm, and (C) a colorant, as well as a method for manufacturing the same and a semiconductor device using the same. The present invention also provides a sealing film excellent in adhesiveness and shape retention as a sealing film which comprises a resin layer containing the above (A), (B) and (C) and having a resin layer having a viscosity within the range of 10000 to 100000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, as well as a semiconductor device using the same.

摘要翻译： 本发明提供作为密封膜的填充性和密合性优异的密封膜，该密封膜包含含有下述（A），（B）和（C）的树脂层，并且在80℃下流动在150〜1800μm的范围内 ℃：（A）含有（a1）包含交联官能团并且重均分子量为100,000以上且Tg在-50〜50℃的范围内的高分子量成分的树脂成分 和（a2）包含环氧树脂作为主要成分的热塑性组分，（B）平均粒度在1至30μm范围内的填料和（C）着色剂，以及制备 相同的半导体器件和使用其的半导体器件。 本发明还提供了作为密封膜的粘合性和形状保持性优异的密封膜，其包含含有上述（A），（B）和（C）的树脂层，并且具有粘度在10000以下的树脂层 在50〜100℃的B阶状态下，在热固性粘弹性测定中为100000Pa.s，以及使用其的半导体装置。

公开(公告)号：US08715454B2

公开(公告)日：2014-05-06

申请号：US13619314

申请日：2012-09-14

申请人： Hiroyuki Kawakami ,  Katsuyasu Niijima ,  Naoki Tomori ,  Daichi Takemori ,  Takuya Imai

发明人： Hiroyuki Kawakami ,  Katsuyasu Niijima ,  Naoki Tomori ,  Daichi Takemori ,  Takuya Imai

IPC分类号： B29C65/00 ,  B32B37/00 ,  B32B38/10 ,  C09J163/00 ,  H01L23/28

CPC分类号： H01L23/293 ,  C08G59/621 ,  C08K3/013 ,  C08L63/00 ,  C08L2666/54 ,  C08L2666/72 ,  H01L23/28 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/24967 ,  Y10T428/25 ,  Y10T428/26 ,  Y10T428/31511 ,  H01L2924/00

摘要： A method for sealing electrodes on a semiconductor device using a sealing film which includes a resin layer having a flow within the range of 150 to 1800 μm at 80° C., or having a resin layer with a viscosity within the range of 10,000 to 100,000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of −50 to 50° C. and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 μm, and (C) a colorant.

摘要翻译： 一种使用密封膜在半导体器件上密封电极的方法，所述密封膜包括在80℃下流动在150至1800μm范围内的树脂层，或具有粘度在10,000至100,000范围内的树脂层 在热固性粘弹性测定中，在50〜100℃下处于B阶状态的Pa·s，含有：（A）包含（a1）包含交联官能团的高分子量成分，重均分子量 为10〜10重量％，Tg为-50〜50℃，（a2）以环氧树脂为主要成分的热固性成分，（B）平均粒径为1〜 30μm，（C）着色剂。