公开(公告)号：US20240354482A1

公开(公告)日：2024-10-24

申请号：US18751817

申请日：2024-06-24

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Wuhua LI ,  Yu ZHOU ,  Haoze LUO ,  Sheng ZHENG ,  Sizhan ZHOU ,  Huibin CHEN

IPC: G06F30/392 ,  G06F30/323 ,  G06F111/02

CPC classification number: G06F30/392 ,  G06F30/323 ,  G06F2111/02

Abstract: In the field of power module technologies, a method and an apparatus for designing a substrate of a power module and a terminal device may be provided. The method includes: obtaining input parameters for designing the substrate of the power module; determining types of basic layout units and a quantity of basic layout units of each type in a circuit topology based on information about the circuit topology and a prestored diagram of a structure of each type of basic layout unit; and connecting, by using a pathfinding model, a connection path of graph elements of each basic layout unit in the circuit topology, to obtain a connection diagram of the substrate of the power module.

公开(公告)号：US20220285947A1

公开(公告)日：2022-09-08

申请号：US17686163

申请日：2022-03-03

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Wanyuan QU ,  Fangcheng LIU ,  Lei SHI ,  Wuhua LI

IPC: H02J3/38 ,  H02M3/156 ,  H02M1/00

Abstract: A voltage conversion circuit includes: an inductor, a first switch module, N second switch modules connected in series, N third switch modules connected in series, and N−1 flying capacitors. One terminal of the first switch module is separately connected to one terminal of the N second switch modules connected in series and one terminal of the N third switch modules connected in series. The other terminal of the N third switch modules connected in series is connected to a positive electrode of a high-voltage power supply. The other terminal of the first switch module and the other terminal of the N second switch modules connected in series are connected to a negative electrode of the high-voltage power supply. A low-voltage power supply is connected to the two terminals of the first switch module through the inductor. In embodiments of this application, a higher boost ratio can be implemented.