公开(公告)号：US20220270952A1

公开(公告)日：2022-08-25

申请号：US17668158

申请日：2022-02-09

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yankun Xu ,  Yue Chen ,  Yang Zhao ,  Ruoyang Du

IPC: H01L23/40 ,  H05K1/02

Abstract: This disclosure provides a power device, a power device assembly, and a related apparatus. The power device includes a package body and a plurality of pins. The package body includes a substrate structure, a semiconductor die, and a molded package. The semiconductor die is disposed on the substrate structure. The substrate structure includes a heat dissipation surface connectable to a heat sink. A first end of each pin is connected to the substrate structure. The molded package covers the semiconductor die and the substrate structure excluding the heat dissipation surface. A second end of each pin and the heat dissipation surface are both uncovered from the molded package. The second end of each pin includes a mounting surface connectable to a circuit board through a surface-mount technology to form an electrical connection.

公开(公告)号：US11862531B2

公开(公告)日：2024-01-02

申请号：US17668158

申请日：2022-02-09

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yankun Xu ,  Yue Chen ,  Yang Zhao ,  Ruoyang Du

IPC: H01L23/40 ,  H05K1/02

CPC classification number: H01L23/4006 ,  H05K1/0204 ,  H05K1/0209 ,  H01L2023/405 ,  H05K2201/066

Abstract: This disclosure provides a power device, a power device assembly, and a related apparatus. The power device includes a package body and a plurality of pins. The package body includes a substrate structure, a semiconductor die, and a molded package. The semiconductor die is disposed on the substrate structure. The substrate structure includes a heat dissipation surface connectable to a heat sink. A first end of each pin is connected to the substrate structure. The molded package covers the semiconductor die and the substrate structure excluding the heat dissipation surface. A second end of each pin and the heat dissipation surface are both uncovered from the molded package. The second end of each pin includes a mounting surface connectable to a circuit board through a surface-mount technology to form an electrical connection.