公开(公告)号：US20220270952A1

公开(公告)日：2022-08-25

申请号：US17668158

申请日：2022-02-09

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yankun Xu ,  Yue Chen ,  Yang Zhao ,  Ruoyang Du

IPC: H01L23/40 ,  H05K1/02

Abstract: This disclosure provides a power device, a power device assembly, and a related apparatus. The power device includes a package body and a plurality of pins. The package body includes a substrate structure, a semiconductor die, and a molded package. The semiconductor die is disposed on the substrate structure. The substrate structure includes a heat dissipation surface connectable to a heat sink. A first end of each pin is connected to the substrate structure. The molded package covers the semiconductor die and the substrate structure excluding the heat dissipation surface. A second end of each pin and the heat dissipation surface are both uncovered from the molded package. The second end of each pin includes a mounting surface connectable to a circuit board through a surface-mount technology to form an electrical connection.

公开(公告)号：US20220406679A1

公开(公告)日：2022-12-22

申请号：US17888625

申请日：2022-08-16

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Ruoyang Du ,  Zhen Lv ,  Chaoyang Guo ,  Wei Wu ,  Bingzhi Wu

IPC: H01L23/373 ,  H01L25/065 ,  H01L25/18 ,  H01L25/00 ,  H01L21/48 ,  H01L23/00

Abstract: A method for producing a power semiconductor system includes packaging a power device in plastic to form a power semiconductor component, forming a first heat dissipation face on a surface of the power semiconductor component; heating a first material between a first heat sink and the first heat dissipation face; and cooling the first material on the first heat dissipation face to connect the power semiconductor component and the first heat sink.

公开(公告)号：US12199543B2

公开(公告)日：2025-01-14

申请号：US18178553

申请日：2023-03-06

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Ruoyang Du

IPC: H02P29/68

Abstract: The disclosure discloses a motor driving method, an apparatus, and a system, and relate to the chip field. The solution may include: When a motor control apparatus determines that a motor needs to rotate at a maximum torque, the motor control apparatus controls a driver to output a first current to drive the motor to rotate. The first current is greater than a rated peak current of the driver and is less than or equal to a maximum load current of the driver. This method can resolve a problem that a waste of costs is caused because a through-current capability improved by a redundancy design of a switching transistor of a motor driver cannot be fully utilized for most customers and application scenarios.

公开(公告)号：US11862531B2

公开(公告)日：2024-01-02

申请号：US17668158

申请日：2022-02-09

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yankun Xu ,  Yue Chen ,  Yang Zhao ,  Ruoyang Du

IPC: H01L23/40 ,  H05K1/02

CPC classification number: H01L23/4006 ,  H05K1/0204 ,  H05K1/0209 ,  H01L2023/405 ,  H05K2201/066

Abstract: This disclosure provides a power device, a power device assembly, and a related apparatus. The power device includes a package body and a plurality of pins. The package body includes a substrate structure, a semiconductor die, and a molded package. The semiconductor die is disposed on the substrate structure. The substrate structure includes a heat dissipation surface connectable to a heat sink. A first end of each pin is connected to the substrate structure. The molded package covers the semiconductor die and the substrate structure excluding the heat dissipation surface. A second end of each pin and the heat dissipation surface are both uncovered from the molded package. The second end of each pin includes a mounting surface connectable to a circuit board through a surface-mount technology to form an electrical connection.

公开(公告)号：US20230208343A1

公开(公告)日：2023-06-29

申请号：US18178553

申请日：2023-03-06

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Ruoyang Du

IPC: H02P29/68

CPC classification number: H02P29/68

Abstract: The disclosure discloses a motor driving method, an apparatus, and a system, and relate to the chip field. The solution may include: When a motor control apparatus determines that a motor needs to rotate at a maximum torque, the motor control apparatus controls a driver to output a first current to drive the motor to rotate. The first current is greater than a rated peak current of the driver and is less than or equal to a maximum load current of the driver. This method can resolve a problem that a waste of costs is caused because a through-current capability improved by a redundancy design of a switching transistor of a motor driver cannot be fully utilized for most customers and application scenarios.