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    VEHICLE-MOUNTED DEVICE AND VEHICLE
    1.
    发明申请
    VEHICLE-MOUNTED DEVICE AND VEHICLE 有权

    公开(公告)号：US20220142010A1

    公开(公告)日：2022-05-05

    申请号：US17574766

    申请日：2022-01-13

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： Yonghai Mao ,  Zhenming Hu ,  Jianqiang Yin ,  Xiaofei Li

    IPC: H05K7/20 ,  H05K1/02

    Abstract: This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.

    Electronic Device Having Floating Support Structure
    2.
    发明公开
    Electronic Device Having Floating Support Structure 审中-公开

    公开(公告)号：US20230300970A1

    公开(公告)日：2023-09-21

    申请号：US18324439

    申请日：2023-05-26

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Dongming Yu ,  Zhenming Hu ,  Peihua Cui ,  Lei Xiang

    IPC: H05K1/02 ,  H05K7/12 ,  H05K7/20 ,  B60R16/023 ,  H05K1/18

    CPC classification number: H05K1/0203 ,  B60R16/023 ,  H05K1/181 ,  H05K7/12 ,  H05K7/2039 ,  H05K2201/06

    Abstract: An electronic device includes a housing assembly, a circuit board, an electronic component, and a floating support assembly that are assembled together. Installation space is formed in the housing assembly. The circuit board, the electronic component, and the floating support assembly are all accommodated in the installation space. The circuit board is installed in the housing assembly. The electronic component is supported by the circuit board and is in signal communication with the circuit board. The floating support assembly is disposed on the circuit board to support the electronic component or disposed in the housing assembly to support the circuit board, so that the electronic component abuts against the housing assembly under an action of a pre-loading force of the floating support assembly.

    Vibration damping bracket and electronic device
    5.
    发明授权
    Vibration damping bracket and electronic device 有权

    公开(公告)号：US12163566B2

    公开(公告)日：2024-12-10

    申请号：US17716469

    申请日：2022-04-08

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： Zhenming Hu ,  Jianqiang Yin ,  Xiaofei Li ,  Rucheng Zhu

    IPC: F16F15/08 ,  F16M13/02 ,  G11B33/08

    Abstract: One example vibration damping bracket provided in some embodiments of this application includes a fastening bracket, a first bracket body, a second bracket body, a first vibration damping component, and a second vibration damping component. The first bracket body is elastically connected to the fastening bracket by using the first vibration damping component. The second bracket body is elastically connected to the first bracket body by using the second vibration damping component. The first vibration damping component includes a metal elastic part configured to absorb vibration, and the second vibration damping component includes a rubber elastic part configured to absorb vibration.

    VEHICLE-MOUNTABLE DEVICE AND VEHICLE
    6.
    发明公开
    VEHICLE-MOUNTABLE DEVICE AND VEHICLE 审中-公开

    公开(公告)号：US20240057300A1

    公开(公告)日：2024-02-15

    申请号：US18495735

    申请日：2023-10-26

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： Yonghai Mao ,  Zhenming Hu ,  Jianqiang Yin ,  Xiaofei Li

    IPC: H05K7/20 ,  H05K1/02

    CPC classification number: H05K7/20872 ,  H05K1/0203 ,  H05K7/20172 ,  H05K7/20854 ,  H05K7/20881 ,  H05K7/20336 ,  H05K7/20454 ,  H05K7/20254 ,  H05K7/20863

    Abstract: This application discloses a vehicle-mountable device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.

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