公开(公告)号：US3311280A

公开(公告)日：1967-03-28

申请号：US45283165

申请日：1965-05-03

Applicant: IBM

Inventor： LARSON HAROLD A ,  SCHULTZ FREDERICK A ,  THOMPSON LEONARD H ,  WELLS JACK F

IPC: B65H23/18 ,  G11B15/28 ,  G11B15/43 ,  G11B15/56 ,  G11B15/60

CPC classification number: G11B15/60 ,  B65H23/18 ,  G11B15/28 ,  G11B15/43 ,  G11B15/56

公开(公告)号：US3677853A

公开(公告)日：1972-07-18

申请号：US3677853D

申请日：1969-12-30

Applicant: IBM

Inventor： ANZELONE THOMAS A JR ,  LARSON HAROLD A ,  STRICKER ALFRED A

IPC: C09J5/00 ,  H01L21/302 ,  H01L21/58 ,  B32B31/00

CPC classification number: H01L24/26 ,  H01L21/302 ,  H01L24/83 ,  H01L2224/83048 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/07802 ,  Y10S228/903 ,  H01L2924/3512 ,  H01L2924/00

Abstract: WAFERS ARE BONDED TO A CARRIER SURFACE WHICH TENDS TO BULGE IN REACTION TO THE BONDING PROCESS, PARTICULARLY HEATING, BUT TO RETURN TO A FLAT CONFIGURATION AFTER BOND CURING. VOID-FREE BONDING IS OBTAINED BY SHAPING THE BONDING MATERIAL TO THE CARRIER BULGE AND INTRODUCING THE WAFER TO THE HIGH POINT OF THE BULGE RELATIVE TO THE FLAT SURFACE OF THE CARRIER. CLOSURE PRESSURE BETWEEN WAFER AND CARRIER AND THE REACTION OF THE CARRIER IN COOLING TO A SUBSTANTIALLY FLAT SURFACE CONFIGURATION COPERATE TO COMPLETE THE BONDING.