Abstract:
A METHOD FOR CONTROLLING MAGNETIC PROPERTIES OF MAGNETIC FILMS BY CONTROLLING THE ROUGHNESS OF THE SUBSTRATE SURFACE ONTO WHICH THE MAGNETIC FILM IS DEPOSITED. ON ONE HAND THE COERCIVITY MAY BE VARIED ALTHOUGH THE MAGNETIC FILM THICKNESS IS BEING KEPT CONSTANT, ON THE OTHER HAND CONSTANT VALUES OF COERCIVITY CAN BE OBTAINED EVEN THOUGH THE THICKNESS OF THE MAGNETIC FILM MAY VARY. THE SUBSTRATE CONSISTS OF A CONDUCTIVE GROUND PLATE COATED WITH A THIN LAYER OF INSULATING MATERIAL AND THEREAFTER COPPER PLATED. PRIOR TO THE DEPOSITION OF THE MAGNETIC FILM, THE COPPER SURFACE IS TREATED BY ELECTRO PULSE PLATING INCLUDING REVERSE PULSING TO OBTAIN A WELL DEFINED AND CONTROLLED SURFACE ROUGHNESS.
Abstract:
An electroplating cell is constructed to prevent current spreading in the electrolyte during the plating of a metal or metal alloy onto a substrate. The cell is constructed such that the cross-sectional area of current path is substantially the same as the cross-sectional area of a pair of electrodes spaced apart in the cell. This is accomplished by placing the electrodes in the cell such that their edges are substantially in contact with the dielectric or insulating walls of the cell. The cell also contains electrolyte agitating means to provide uniform laminar flow of the electrolyte across the surface of one of the electrode. Metal alloy films deposited with the use of this cell exhibit uniform thicknesses on rather large surface areas. Where magnetic metal alloys are plated, the films not only exhibit uniform thicknesses laterally on the whole cathode but uniform composition and magnetic properties throughout as well.