公开(公告)号：US20240301582A1

公开(公告)日：2024-09-12

申请号：US17923563

申请日：2022-02-07

申请人： EBARA CORPORATION

发明人： Yohei WAKUDA ,  Yasuyuki MASUDA ,  Masashi SHIMOYAMA

IPC分类号： C25D17/00 ,  C25D17/06 ,  C25D21/10

CPC分类号： C25D17/008 ,  C25D17/06 ,  C25D21/10

摘要： In a plating apparatus including a shielding member, an ionically resistive element is disposed to be close to a surface to be plated of a substrate to improve uniformity of a distribution of plating film-thickness.
A plating apparatus includes: a plating tank 410 configured to house a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; an anode 430 disposed in the plating tank 410; an ionically resistive element 450 disposed between the substrate Wf and the anode 430 and including an opposed surface 450-a opposed to the surface to be plated Wf-a, the opposed surface 450-a including a first opposed surface 450-a1 and a second opposed surface 450-a2 apart from the surface to be plated Wf-a more than the first opposed surface 450-a1; and a shielding member 481 disposed in a depressed region β of the ionically resistive element 450, the depressed region β being formed by the second opposed surface 450-a2. The shielding member 481 is for shielding an electric field.

公开(公告)号：US20240218553A1

公开(公告)日：2024-07-04

申请号：US17923080

申请日：2021-06-04

申请人： EBARA CORPORATION

发明人： Masashi SHIMOYAMA ,  Yasuyuki MASUDA ,  Kazuhito TSUJI ,  Ryosuke HIWATASHI

IPC分类号： C25D21/12 ,  C25D5/02 ,  C25D17/00 ,  C25D17/06 ,  C25D21/10

CPC分类号： C25D21/12 ,  C25D5/022 ,  C25D17/008 ,  C25D17/06 ,  C25D21/10

摘要： An objective of the present invention is to provide a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder that holds a substrate, an anode disposed, in the plating tank, facing the substrate held by the substrate holder, and a film thickness measuring module including a sensor that detects a parameter related to a plating film formed on a surface to be plated of the substrate, the film thickness measuring module measuring a film thickness of the plating film based on a detection value of the sensor during a plating treatment.

公开(公告)号：US20240209542A1

公开(公告)日：2024-06-27

申请号：US17802447

申请日：2021-12-06

申请人： EBARA CORPORATION

发明人： Kazuhito TSUJI ,  Mizuki NAGAI

IPC分类号： C25D21/10 ,  C25D21/04

CPC分类号： C25D21/10 ,  C25D21/04

摘要： Provided is a technique that allows removing gas bubbles attached to a hole of an ionically resistive element.
A plating method includes: stirring a plating solution by driving a paddle arranged above the ionically resistive element in a state where an anode and the ionically resistive element are immersed in the plating solution (step S20); immersing a substrate as a cathode in the plating solution in a state where the stirring of the plating solution with the paddle is stopped (step S40); resuming the stirring of the plating solution with the paddle arranged above the ionically resistive element and below the substrate in a state where the substrate is immersed in the plating solution (step S50); and performing a plating process on the substrate by flowing electricity between the substrate and the anode in a state where the stirring of the plating solution with the paddle is resumed (step S60).

公开(公告)号：US20240183059A1

公开(公告)日：2024-06-06

申请号：US17781363

申请日：2021-03-05

申请人： EBARA CORPORATION

发明人： Yasuyuki MASUDA ,  Ryosuke HIWATASHI ,  Masashi SHIMOYAMA

IPC分类号： C25D21/12 ,  C25D17/00 ,  C25D17/08 ,  C25D21/10

CPC分类号： C25D21/12 ,  C25D17/008 ,  C25D17/08 ,  C25D21/10

摘要： There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.

公开(公告)号：US20240183058A1

公开(公告)日：2024-06-06

申请号：US17781356

申请日：2021-09-10

申请人： EBARA CORPORATION

发明人： Kazuhito TSUJI

IPC分类号： C25D21/08 ,  C25D21/10

CPC分类号： C25D21/08 ,  C25D21/10

摘要： Provided is a technique that allows suppressing an entrance of a large amount of a rinse solution into a plating solution in a plating tank.
A plating apparatus 1000 includes a rinse module 40 configured to perform a rinse process. The rinse module includes: a rinse nozzle 41 configured to discharge the rinse solution to a member to be rinsed 25 while the rinse process is performed; a blow nozzle 42 disposed below the rinse nozzle and blowing out a gas such that the gas crosses a space between the plating tank and a substrate holder 20 while the rinse process is performed; and a collection member 50 disposed at downstream of the gas blown out from the blow nozzle and collecting the rinse solution dropping from the member to be rinsed and entrained in a flow of the gas blown out from the blow nozzle.

公开(公告)号：US11987897B2

公开(公告)日：2024-05-21

申请号：US15400586

申请日：2017-01-06

申请人： APPLIED Materials, Inc.

发明人： Eric J. Bergman ,  Jeffrey J. Dennison ,  Marvin L. Bernt

IPC分类号： C25D17/00 ,  C25D5/02 ,  C25D5/04 ,  C25D21/10

CPC分类号： C25D17/002 ,  C25D5/022 ,  C25D5/04 ,  C25D17/008 ,  C25D21/10 ,  C25D17/005

摘要： In one embodiment, an electroplating cell for depositing a metal onto a surface of a substrate includes an electroplating chamber configured to receive an electrolyte containing metal ions and a substrate having a surface disposed to contact the electrolyte, wherein the surface of the substrate is configured to serve as a cathode and wherein the surface of the substrate includes an anomaly region at or near the outer perimeter of the surface of the substrate, an anode disposed in the electrolyte chamber, a shielding device disposed between the cathode and the anode to shield the anomaly section, an oscillator configured to impart a relative oscillation between the cathode and the shielding device, and a power source to cause an electric field between the anode and the cathode.

公开(公告)号：US11926917B2

公开(公告)日：2024-03-12

申请号：US17790545

申请日：2020-06-10

申请人： DOWA METALTECH CO., LTD.

发明人： Yukiya Kato ,  Hirotaka Kotani ,  Tatsuhiro Doi ,  Takao Tomiya ,  Hiroto Narieda

IPC分类号： C25D15/00 ,  C25D3/46 ,  C25D5/12 ,  C25D21/10 ,  H01B1/02

CPC分类号： C25D15/00 ,  C25D3/46 ,  C25D5/12 ,  C25D21/10 ,  H01B1/02

摘要： There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.

公开(公告)号：US20230340687A1

公开(公告)日：2023-10-26

申请号：US17764454

申请日：2021-03-17

申请人： EBARA CORPORATION

发明人： Masaya SEKI ,  Masaki TOMITA ,  Shao Hua CHANG

IPC分类号： C25D21/08 ,  C25D17/06 ,  C25D21/10 ,  C25D21/12 ,  C25D17/00

CPC分类号： C25D21/08 ,  C25D17/06 ,  C25D21/10 ,  C25D21/12 ,  C25D17/005

摘要： A plating apparatus 1000 includes a plating tank, a substrate holder 20, a rotation mechanism, an elevating mechanism, a contact member 40, and a cleaning device 50 configured to clean the contact member 40. The cleaning device 50 includes a pivot shaft 51, a first arm 53, a second arm 54, and a nozzle 55 that includes at least one discharge port. Applying a cleaning fluid discharged from the discharge port to the contact member 40 cleans the contact member 40.

公开(公告)号：US20230313407A1

公开(公告)日：2023-10-05

申请号：US18010075

申请日：2021-03-25

申请人： SEMSYSCO GMBH

发明人： Herbert ÖTZLINGER ,  Marianne KOLITSCH-MATALN ,  Harald OKORN-SCHMIDT ,  Andreas GLEISSNER

IPC分类号： C25D17/00 ,  C25D21/10 ,  C25D5/02

CPC分类号： C25D17/008 ,  C25D21/10 ,  C25D5/026

摘要： The invention relates to a shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, use of a shield body system, and a method for a chemical and/or electrolytic surface treatment of a substrate in a process fluid. The shield body system comprises a shield body and an agitation unit. The shield body has a plurality of openings to direct the process fluid flow and/or a current density distribution towards the substrate to be treated. The agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a distribution body. Alternatively or additionally, the agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a deposition chamber for chemical and/or electrolytic surface treatment.

公开(公告)号：US20230193504A1

公开(公告)日：2023-06-22

申请号：US18111487

申请日：2023-02-17

申请人： Applied Materials, Inc.

发明人： Paul R. McHugh ,  Gregory J. Wilson

IPC分类号： C25D21/10 ,  C25D5/08 ,  C25D17/02 ,  C25D7/12 ,  C25D17/00

CPC分类号： C25D21/10 ,  C25D5/08 ,  C25D17/02 ,  C25D7/12 ,  C25D17/001

摘要： Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a substrate in the vessel. The system may further include a first reservoir in fluid communication with the vessel. In addition, the system may include a second reservoir in fluid communication with the vessel. Furthermore, the system may include a first mechanism configured to expel a second portion of the liquid electrolyte from the first reservoir into the vessel. The system may also include a second mechanism configured to take in a third potion of the liquid electrolyte from the vessel into the second reservoir when the second portion of the liquid electrolyte is expelled from the first reservoir. Methods may include oscillating flow of the electrolyte within the vessel.