公开(公告)号：US3523824A

公开(公告)日：1970-08-11

申请号：US3523824D

申请日：1966-12-29

Applicant: IBM

Inventor： POWERS JOHN V ,  ROMANKIW LUBOMYR T

IPC: C23C18/20 ,  C23C18/28 ,  H01F10/12 ,  H01F41/24 ,  H01F41/26 ,  G11B5/84

CPC classification number: C23C18/208 ,  C23C18/2006 ,  C23C18/28 ,  C23C18/30 ,  H01F10/12 ,  H01F41/24 ,  H01F41/26

公开(公告)号：US3702263A

公开(公告)日：1972-11-07

申请号：US3702263D

申请日：1970-02-20

Applicant: IBM

Inventor： HALL DAVID W ,  LINDHOLM JOHN A ,  ROMANKIW LUBOMYR T ,  SCHMECKENBECHER AINOLD F

IPC: C23C18/36 ,  C23C18/50 ,  H01F41/24 ,  H01F10/00

CPC classification number: H01F41/24 ,  C23C18/36 ,  C23C18/50 ,  Y10S428/928 ,  Y10S428/936 ,  Y10T428/12979

Abstract: A PROCESS FOR ELECTROLESSLY PLATING SUBSTRATES WITH THIN FILMS OF MAGNETIC MATERIAL WHICH IS CARRIED OUT IN A TEMPERATURE RANGE WHICH INCLUDES ROOM TEMPERATURE. THE PROCESS INCLUDES THE IMMERSION OF SUBSTRATE IN AN AQUEOUS SOLUTION WHICH CONTAINS IRON IONS AND AT LEAST ANOTHER METAL ION SUCH AS NICKEL, WHICH UPON DEPOSITION FORM THE MAGNETIC MATERIAL. A REDUCING AGENT SUCH AS SODIUM HYPOPHOSPHITE IS PROVIDED IN THE BATH IN AN AMOUNT SUFFICIENT TO CAUSE DEPOSITION OF THE METALS IN SMALL GRAIN SIZES. SUFFICIENT HYDROXYL IONS ARE ALSO PROVIDED TO MAINTAIN THE BATH IN CONDITIONS WHICH RANGE FROM SLIGHTLY ACIDIC TO HIGHLY ALKALINE. THE BATH IS THEN MAINTAINED IN A TEMPERATURE RANGE WHICH INCLUDES ROOM TEMPERATURE OVER WHICH RANGE THIN FILMS HAVING A CHARACTERISTIC SILVERY FINISH INDICATIVE OF SMALL GRAIN SIZE ARE PRODUCED. THE PROCESS ALSO INCLUDES THE STEP OF AGING A FERROUS BATH FOR A PERIOD OF TIME SUFFICIENT TO CONVERT THE FERROUS IONS TO STABILIZE THE BATH. THE ABOVE-MENTIONED CONSTITUENTS AND OTHER COMPLEXING AND BUFFERING AGENTS WHICH PREVENT THE PRECIPITATION OF THE METALS FROM SOLUTION ARE PRESENT IN THE SOLUTION IN SELECTED CONCENTRATIONS WHICH PERMIT THE PLATING OF SMALL GRAIN SIZE MAGNETIC FILMS AT LOW TEMPERATURE.

公开(公告)号：US3602635A

公开(公告)日：1971-08-31

申请号：US3602635D

申请日：1970-06-30

Applicant: IBM

Inventor： ROMANKIW LUBOMYR T

IPC: H01F10/06 ,  H01L27/00 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4685 ,  H01F10/06 ,  H01L27/00 ,  Y10T29/49069

Abstract: A microcircuit device such as a printed circuit or an integrated circuit is described wherein the thickness of insulation between two crossing conductive bodies can be substantially decreased as compared to the corresponding thickness in known like devices. In the case for example, such as magnetic coupled film memory devices wherein a low temperature insulating material can be employed and wherein such insulating material is subject to surface tension effects, this is achieved by retaining the photoresist layer on the surface of the metal magnetic bodies resting on the substrate and etching the magnetic bodies to the point where the width of the upper surfaces of the conducting bodies are equal to the width of the nonconductive resist used in the etching or where there is a slight undercut under their retained respective photoresist layers, i.e., the layer on each body extends beyond the perimeter of the surface of the bodies. Such photoresist layer protects sharp metal corners or, in the latter case, provides an umbrella effect in that it extends beyond the sharp edges of the magnetic bodies, the latter being potential areas for electrical shorts. In the case where conductive bodies are employed which generate high temperatures or which have to withstand high service temperatures and wherein correspondingly high temperature insulating materials have to be used or in which it is desired to have very thin hard insulations such as are produced in the use of inorganic insulations, glasses and the like, the aforementioned ''''umbrella'''' effect is provided by a layer of high temperature insulating materials of organic or inorganic compositions on the conducting body''s surface rather than the layer of photoresist material. In this latter case, the insulation thickness can be much thinner than the commonly accepted rule of thumb thickness which is twice that of the conducting bodies for conducting bodies of 30000A. or thicker and even greater such as four or five to one for conducting bodies considerably thinner than 3000A. (for example, 200 to 500A. thick).

公开(公告)号：US3382079A

公开(公告)日：1968-05-07

申请号：US41870664

申请日：1964-12-16

Applicant: IBM

Inventor： OLSEN JUDITH D ,  ROMANKIW LUBOMYR T

IPC: C23C18/31 ,  C23C18/50

CPC classification number: C23C18/50 ,  C23C18/31

公开(公告)号：US3908194A

公开(公告)日：1975-09-23

申请号：US49850474

申请日：1974-08-19

Applicant: IBM

Inventor： ROMANKIW LUBOMYR T

IPC: G11B5/11 ,  G11B5/265 ,  G11B5/31 ,  G11B5/39 ,  G11B5/30 ,  G11B5/42

CPC classification number: G11B5/3903 ,  G11B5/3967 ,  Y10T29/49064

Abstract: A thin film head includes a permeable substrate providing a first shield, which may include a more highly permeable layer on its upper surface for shielding, a layer of permeable material thereon providing a second shield and a first write head leg referred to as the shielding-leg layer and a magnetic gap filled with dielectric material between the substrate and the shieldingleg layer. A magnetoresistive stripe including permeable material extends within the dielectric in said gap near the tip end of the head spaced from the substrate and the shielding-leg layer. An inductive single turn or multiturn writing winding is formed upon a layer of dielectric on the other side of the shielding-leg layer. A second leg layer covers the half of the spiral winding towards the tip end of the head and extends through an opening into contact with the shielding-leg layer.

Abstract translation: 薄膜头包括提供第一屏蔽的可渗透基底，其可以在其上表面上包括用于屏蔽的更高渗透性的层，其上提供第二屏蔽的可渗透材料层和被称为屏蔽层的第一写头腿， 腿层和在衬底和屏蔽腿层之间填充介电材料的磁隙。 包括可渗透材料的磁阻条在所述间隙附近的所述间隙内延伸，与所述基底和所述屏蔽腿层间隔开。 在屏蔽腿层的另一侧上的电介质层上形成感应单圈或多圈书写绕组。 第二支腿层朝向头部的尖端覆盖螺旋形卷绕的一半，并延伸穿过与屏蔽腿层接触的开口。

公开(公告)号：US3652442A

公开(公告)日：1972-03-28

申请号：US3652442D

申请日：1970-04-06

Applicant: IBM

Inventor： POWERS JOHN V ,  ROMANKIW LUBOMYR T

IPC: C25D5/00 ,  C25D17/00 ,  H01F17/00 ,  H01F17/06 ,  B01K3/00

CPC classification number: C25D21/10 ,  C25D5/006 ,  C25D5/08 ,  C25D17/12 ,  H01F17/0033 ,  H01F17/06 ,  Y10T29/49073

Abstract: An electroplating cell is constructed to prevent current spreading in the electrolyte during the plating of a metal or metal alloy onto a substrate. The cell is constructed such that the cross-sectional area of current path is substantially the same as the cross-sectional area of a pair of electrodes spaced apart in the cell. This is accomplished by placing the electrodes in the cell such that their edges are substantially in contact with the dielectric or insulating walls of the cell. The cell also contains electrolyte agitating means to provide uniform laminar flow of the electrolyte across the surface of one of the electrode. Metal alloy films deposited with the use of this cell exhibit uniform thicknesses on rather large surface areas. Where magnetic metal alloys are plated, the films not only exhibit uniform thicknesses laterally on the whole cathode but uniform composition and magnetic properties throughout as well.

Abstract translation: 构造电镀单元以防止在将金属或金属合金电镀到基底上时电解液中的电流扩散。 电池被构造成使得电流路径的横截面面积与电池中间隔开的一对电极的横截面面积基本相同。 这通过将电极放置在电池中使得它们的边缘基本上与电池的电介质或绝缘壁接触来实现。 电池还包含电解质搅拌装置，以使得电解质在电极之一的表面上均匀地层流。 使用该电池沉积的金属合金膜在相当大的表面积上表现出均匀的厚度。 在电镀金属合金的情况下，薄膜不仅在整个阴极上横向显示出均匀的厚度，而且整体上的组成和磁性均匀。

公开(公告)号：US3483534A

公开(公告)日：1969-12-09

申请号：US3483534D

申请日：1966-07-15

Applicant: IBM

Inventor： CASTELLANI EUGENE E ,  KEEFE GEORGE E ,  ROMANKIW LUBOMYR T

IPC: G11C11/15 ,  G11C17/02 ,  G11B5/00

CPC classification number: G11C11/15 ,  G11C17/02

公开(公告)号：US3662119A

公开(公告)日：1972-05-09

申请号：US3662119D

申请日：1970-06-30

Applicant: IBM

Inventor： ROMANKIW LUBOMYR T ,  WARDLY GEORGE A

IPC: G11B5/17 ,  G11B5/31 ,  G11B5/12 ,  G11B5/42

CPC classification number: G11B5/17 ,  G11B5/31 ,  G11B5/313 ,  Y10T29/49044 ,  Y10T29/49064

Abstract: A rectangular thin film transducer head includes a magnetic core composed of overlapping laminations of permalloy film joined together magnetically and electrically, near an air gap, at one end of the rectangle, between the two laminations, which gap couples flux to the magnetic recording medium. Two electrically parallel insulated thin film copper windings starting at the end opposite the gap are deposited about the core joining electrically at the end adjacent to the gap to a conductor coupled to both permalloy laminations which conduct return current through the legs of the core inside of the windings. Alternatively, a single series winding passes around the core and through the gap. The head is manufactured by means of photolithographic, vacuum, and thin film techniques.

Abstract translation: 矩形薄膜换能器头包括由磁力和电气连接在一起的坡莫合金膜的重叠叠层组成的磁芯，靠近在两个叠片之间的矩形的一端的气隙，该间隙将磁通耦合到磁记录介质。 在与间隙相对的端部处开始的两个电并联绝缘薄膜铜绕组围绕磁芯在与邻近间隙的端部处电连接地沉积到耦合到两个坡莫合金叠片的导体上沉积，导体通过芯的内部的引线 绕组。 或者，单个串联绕组绕过芯并穿过间隙。 头部通过光刻，真空和薄膜技术制造。

公开(公告)号：US3573193A

公开(公告)日：1971-03-30

申请号：US3573193D

申请日：1968-12-04

Applicant: IBM

Inventor： POWERS JOHN V ,  ROMANKIW LUBOMYR T

IPC: H01F10/06 ,  C23F17/00 ,  C23B5/34

CPC classification number: H01F10/06

Abstract: A METHOD FOR CONTROLLING MAGNETIC PROPERTIES OF MAGNETIC FILMS BY CONTROLLING THE ROUGHNESS OF THE SUBSTRATE SURFACE ONTO WHICH THE MAGNETIC FILM IS DEPOSITED. ON ONE HAND THE COERCIVITY MAY BE VARIED ALTHOUGH THE MAGNETIC FILM THICKNESS IS BEING KEPT CONSTANT, ON THE OTHER HAND CONSTANT VALUES OF COERCIVITY CAN BE OBTAINED EVEN THOUGH THE THICKNESS OF THE MAGNETIC FILM MAY VARY. THE SUBSTRATE CONSISTS OF A CONDUCTIVE GROUND PLATE COATED WITH A THIN LAYER OF INSULATING MATERIAL AND THEREAFTER COPPER PLATED. PRIOR TO THE DEPOSITION OF THE MAGNETIC FILM, THE COPPER SURFACE IS TREATED BY ELECTRO PULSE PLATING INCLUDING REVERSE PULSING TO OBTAIN A WELL DEFINED AND CONTROLLED SURFACE ROUGHNESS.

公开(公告)号：US3370973A

公开(公告)日：1968-02-27

申请号：US42171264

申请日：1964-12-28

Applicant: IBM

Inventor： ROMANKIW LUBOMYR T

IPC: C03C17/10 ,  C03C17/40 ,  C23C18/18 ,  H01B1/00

CPC classification number: C23C18/1879 ,  C03C17/10 ,  C03C17/40 ,  C23C18/1865 ,  H01B1/00