公开(公告)号：US3560675A

公开(公告)日：1971-02-02

申请号：US3560675D

申请日：1969-05-26

Applicant: IBM

Inventor： KRAKINOWSKI MORRIS ,  STILLWELL GEORGE R JR

IPC: G06F3/02 ,  G06F3/041 ,  H01H13/702 ,  H01H13/703 ,  H01H13/785 ,  H01H35/00 ,  H01H43/08

CPC classification number: H01H13/785 ,  H01H13/702 ,  H01H13/703 ,  H01H2201/026 ,  H01H2207/022 ,  H01H2209/03 ,  H01H2209/038 ,  H01H2209/04 ,  H01H2209/052 ,  H01H2209/06 ,  H01H2209/074 ,  H01H2209/082 ,  H01H2211/018 ,  H01H2227/018 ,  H01H2229/00 ,  H01H2231/004

Abstract: A two layer planar multicontact switch including a first substrate layer having a plurality of parallel conductive lines deposited on the upper surface thereof and a second diaphragm layer located over the substrate layer and having a plurality of parallel conductive lines deposited on the lower surface thereof. The conductive lines on the substrate are normal to the conductive lines on the diaphragm such that a plurality of matrix switch intersections are formed. The conductive lines on the substrate and the diaphragm have insulating material selectively deposited thereon to electrically isolate the upper and lower conductive lines except at the points of intersection. The diaphragm layer may be mechanically depressed at the intersection points to selectively connect the upper lines with the lower lines to form switch closure contacts. The diaphragm and the substrate are formed from transparent material so that the switch can be employed in combination with a visual display.