公开(公告)号：US20230201975A1

公开(公告)日：2023-06-29

申请号：US17745131

申请日：2022-05-16

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Shou-Yi HO ,  Jyh-Long JENG

IPC: B23K35/02 ,  B23K35/26

CPC classification number: B23K35/025 ,  B23K35/262 ,  B23K2103/08

Abstract: A solder ball with a concave-convex structure is provided. The solder ball with a concave-convex structure includes tin-bismuth alloy including a plurality of concave portions and convex portions on its surface. The height difference between the concave portions and the convex portions is between about 10 nanometers and about 200 nanometers. The proportion of tin in the tin-bismuth alloy is between about 28% and about 52%. A method for preparing the solder ball with a concave-convex structure is also provided.

公开(公告)号：US20210202126A1

公开(公告)日：2021-07-01

申请号：US16731680

申请日：2019-12-31

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ying-Xuan LAI ,  Shou-Yi HO ,  Yi-Chi YANG ,  Yen-Chun LIU

IPC: H01B1/22 ,  C08K3/08 ,  C08L81/04

Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.

公开(公告)号：US20210104339A1

公开(公告)日：2021-04-08

申请号：US16729940

申请日：2019-12-30

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Shou-Yi HO ,  Yen-Chun LIU ,  Kuo-Chan CHIOU ,  Hsien-Kuang LIN

IPC: H01B1/22 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62 ,  C08K3/08 ,  C08G59/24

Abstract: A conductive composition and a method for fabricating a micro light-emitting diode (LED) display are provided. The conductive composition includes 5-90 parts by weight of monomer, 10-95 parts by weight of epoxy resin, and 50-150 parts by weight of conductive powder. The total weight of the monomer and the epoxy resin is 100 parts by weight. The monomer has n reactive functional groups, wherein n is 1, 2, 3 or 4. The monomer has a molecular weight equal to or less than 350. The epoxy resin has an epoxy equivalent weight (EEW) from 160 g/Eq to 3500 g/Eq. Furthermore, there is a specific relationship among the weight of monomer, the number of reactive functional groups, the molecular weight of monomer, the weight of epoxy resin, and the epoxy equivalent weight of epoxy resin.

公开(公告)号：US20200095357A1

公开(公告)日：2020-03-26

申请号：US16232581

申请日：2018-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Shou-Yi HO ,  Kuo-Chan CHIOU

IPC: C08F220/70 ,  C08F212/08 ,  C08K3/04 ,  C08J5/18

Abstract: A modified copolymer is provided. The modified copolymer includes a random copolymer of a repeat unit of formula (I) and a repeat unit of formula (II) wherein M is derived from monomers with double bonds, R is a direct bond or an aliphatic hydrocarbon chain group having 1 to 12 carbon atoms, a cyclic aliphatic hydrocarbon group having 3 to 16 carbon atoms, an alkylcarbonyloxy group having 2 to 6 carbon atoms, a carbonyl group, an ether group, an ester group, an amide group, an aromatic group having 6 to 16 carbon atoms, or a divalent group having any of the above groups, wherein m and x are positive integers less than 50. The weight average molecular weight of the modified copolymer is between 3000 and 30000.