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公开(公告)号：US20210202126A1
公开(公告)日：2021-07-01
申请号：US16731680
申请日：2019-12-31
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Ying-Xuan LAI , Shou-Yi HO , Yi-Chi YANG , Yen-Chun LIU
Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.
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公开(公告)号：US20210104339A1
公开(公告)日：2021-04-08
申请号：US16729940
申请日：2019-12-30
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Shou-Yi HO , Yen-Chun LIU , Kuo-Chan CHIOU , Hsien-Kuang LIN
Abstract: A conductive composition and a method for fabricating a micro light-emitting diode (LED) display are provided. The conductive composition includes 5-90 parts by weight of monomer, 10-95 parts by weight of epoxy resin, and 50-150 parts by weight of conductive powder. The total weight of the monomer and the epoxy resin is 100 parts by weight. The monomer has n reactive functional groups, wherein n is 1, 2, 3 or 4. The monomer has a molecular weight equal to or less than 350. The epoxy resin has an epoxy equivalent weight (EEW) from 160 g/Eq to 3500 g/Eq. Furthermore, there is a specific relationship among the weight of monomer, the number of reactive functional groups, the molecular weight of monomer, the weight of epoxy resin, and the epoxy equivalent weight of epoxy resin.
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公开(公告)号：US20220372189A1
公开(公告)日：2022-11-24
申请号：US17497673
申请日：2021-10-08
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Wen-Pin TING , Kuei-Yi CHUANG , Shih-Yao LIANG , Yen-Chun LIU
IPC: C08F222/10 , C08F216/12 , C08F222/22 , C08F222/20 , C08F236/04 , C08F222/40
Abstract: A copolymer is formed by reacting (A) aromatic monomer, an oligomer thereof, or a polymer thereof, with (B) aliphatic monomer, an oligomer thereof, or a polymer thereof. The aromatic monomer has a chemical structure of in which each of R1 is independently H or CH3, and n=1-4. R2 is a single bond, —O—, Each of R3 is independently
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Patent Agency Ranking
公开(公告)号：US20190211138A1
公开(公告)日：2019-07-11
申请号：US16146084
申请日：2018-09-28
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Yen-Chun LIU , Min-Chian WANG , Hsiang-Yen TSAO , Kuo-Chan CHIOU
CPC classification number: C08G59/22 , C08G59/226 , C08G59/24 , C08G59/245 , C08G59/5026 , C08G59/5033 , C08G59/52 , C08G59/56 , C08K3/22 , C08K2003/2227 , C08K2201/001 , C09D163/00 , C09K5/14
Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
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公开(公告)号：US20210189057A1
公开(公告)日：2021-06-24
申请号：US16727285
申请日：2019-12-26
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Kuei-Yi CHUANG , Kuo-Chan CHIOU , Yen-Chun LIU
Abstract: A degradation method of thermosetting resin is provided. The method includes the following steps, for example, a first resin composition is provided. The resin in the first resin composition includes a carbon-nitrogen bond, an ether bond, an ester bond or a combination thereof. The first resin composition and a catalyst composition are mixed to perform a degradation reaction to form a second resin composition. The catalyst composition includes a transition metal compound and a group IIIA metal compound. The second resin composition includes a resin monomer or an oligomer thereof having functional groups. The functional group includes an amine group, a hydroxyl group, an ester group, an acid group or a combination thereof. A catalyst composition used in the degradation method and a resin composition obtained by the degradation method are also provided.
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公开(公告)号：US20170158934A1
公开(公告)日：2017-06-08
申请号：US15046973
申请日：2016-02-18
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Yen-Chun LIU , Hui-Wen CHANG , Min-Chian WANG , Kuo-Chan CHIOU
CPC classification number: C09K5/14 , C08G73/10 , C08G73/1035 , C08G73/1046 , C08G73/14 , C08K3/34 , C08K2003/2227 , C08K2003/282 , C08K2003/382 , C08L79/08
Abstract: A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.
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公开(公告)号：US20170158932A1
公开(公告)日：2017-06-08
申请号：US14974616
申请日：2015-12-18
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Yen-Chun LIU , Hui-Wen CHANG , Hsiang-Yen TSAO , Kuo-Chan CHIOU
CPC classification number: C09K5/14 , C08G59/22 , C08G59/226 , C08G59/24 , C08G59/245 , C08G59/50 , C08G59/5033 , H01L23/3737
Abstract: An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4′-methylenedianiline, 4,4′-ethylenedianiline, 4,4′-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.
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8.发明申请公开(公告)号：US20150166347A1
公开(公告)日：2015-06-18
申请号：US14484430
申请日：2014-09-12
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Chen-Lung LIN , Yen-Chun LIU , Hui-Wen CHANG , Kuo-Chan CHIOU , Hsien-Lin HU
CPC classification number: C01B31/04 , C01B32/20 , C08G73/1035 , C08G73/1042 , C08G73/1053 , C08G73/1067 , C08G73/1071 , C08G73/14 , C09D179/08
Abstract: A polyamide-imide represented by the following formula is provided. A graphite film prepared by performing a thermal treatment process on the polyamide-imide represented by the above-mentioned formula is also provided. In the thermal treatment process, the temperature range of the thermal treatment process ranges from 25° C. to 2,900° C.
Abstract translation: 提供由下式表示的聚酰胺 - 酰亚胺。 还提供了通过对由上述式表示的聚酰胺 - 酰亚胺进行热处理工艺制备的石墨膜。 在热处理过程中，热处理工艺的温度范围为25℃至2900℃。
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