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公开(公告)号:US20240238911A1
公开(公告)日:2024-07-18
申请号:US18512534
申请日:2023-11-17
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Yi-Chi YANG , Jyh-Long JENG
CPC classification number: B23K35/025 , B22F1/052 , B22F1/102 , B22F1/103 , B22F3/10 , H01B1/22 , B22F2301/255 , B22F2302/45 , B22F2304/10 , B22F2999/00
Abstract: A conductive composition, conductive layer and electronic device employing the same are provided. The conductive composition includes 3-7 parts by weight of a component (A) and 93-97 parts by weight of a component (B). The component (A) is an epoxy compound, wherein the epoxy compound is a compound having at least one glycidyloxycarbonyl group. The component (B) includes a first metal particle, wherein the first metal particle has a particle size distribution D90 that is less than or equal to 1 μm. The total weight of the component (A) and component (B) is 100 parts by weight.
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公开(公告)号:US20210202126A1
公开(公告)日:2021-07-01
申请号:US16731680
申请日:2019-12-31
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Ying-Xuan LAI , Shou-Yi HO , Yi-Chi YANG , Yen-Chun LIU
Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.
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