公开(公告)号：US10942323B1

公开(公告)日：2021-03-09

申请号：US16578090

申请日：2019-09-20

Applicant: INPHI CORPORATION

Inventor： Chris Togami ,  Radhakrishnan L. Nagarajan ,  Gary Sasser ,  Brian Taylor

IPC: G02B6/42 ,  H05K7/20 ,  F28F1/14

Abstract: An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

公开(公告)号：US09671580B1

公开(公告)日：2017-06-06

申请号：US15075021

申请日：2016-03-18

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato ,  Chris Togami

IPC: H04B10/00 ,  G02B6/42 ,  H04B10/40 ,  H04B10/50 ,  G02B6/38 ,  G02B6/32 ,  H05K3/30 ,  H04B1/3827

CPC classification number: G02B6/4257 ,  G02B6/32 ,  G02B6/3849 ,  G02B6/3893 ,  G02B6/4206 ,  G02B6/4208 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4251 ,  G02B6/4271 ,  G02B6/428 ,  G02B6/4281 ,  G02B6/4284 ,  G02B6/4286 ,  G02B6/4292 ,  G02B6/4295 ,  G02F1/2255 ,  H04B1/3833 ,  H04B10/40 ,  H04B10/503 ,  H04B10/516 ,  H04J14/02 ,  H05K3/30

Abstract: An apparatus for packaging a photonic transceiver. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices being mounted upside-down via a flex circuit board bended 180 degrees inward to a backside of the PCB and including a built-in TEC module in contact with the lid member. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module.