SEMICONDUCTOR PACKAGE INCLUDING A MODULAR SIDE RADIATING WAVEGUIDE LAUNCHER

    公开(公告)号:US20210265288A1

    公开(公告)日:2021-08-26

    申请号:US16327810

    申请日:2016-09-23

    Abstract: Integration of a side-radiating waveguide launcher system into a semiconductor package beneficially permits the coupling of a waveguide directly to the semiconductor package. Included are a first conductive member and a second conductive member separated by a dielectric material. Also included is a conductive structure, such as a plurality of vias, that conductively couples the first conductive member and the second conductive member. Together, the first conductive member, the second conductive member, and the conductive structure form an electrically conductive side-radiating waveguide launcher enclosing shaped space within the dielectric material. The shaped space includes a narrow first end and a wide second end. An RF excitation element is disposed proximate the first end and a waveguide may be operably coupled proximate the second end of the shaped space.

    WAVEGUIDE CONNECTOR WITH TAPERED SLOT LAUNCHER

    公开(公告)号:US20180090848A1

    公开(公告)日:2018-03-29

    申请号:US15277504

    申请日:2016-09-27

    Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide connector. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a planar first member and a planar second member that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide connector.

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