公开(公告)号：US11062970B2

公开(公告)日：2021-07-13

申请号：US15689463

申请日：2017-08-29

Applicant: Intel Corporation

Inventor： Dinesh P. R. Thanu ,  Hemanth K. Dhavaleswarapu ,  John J. Beatty ,  Syadwad Jain ,  Nachiket R. Raravikar

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.

公开(公告)号：US20180350712A1

公开(公告)日：2018-12-06

申请号：US15610327

申请日：2017-05-31

Applicant: INTEL CORPORATION

Inventor： Dinesh P. R. Thanu ,  Hemanth K. Dhavaleswarapu ,  John J. Beatty ,  Sachin Deshmukh

IPC: H01L23/36 ,  H01L23/498 ,  H01L21/48

Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, a plurality of microelectronic devices attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one of the plurality of microelectronic devices and attached to the microelectronic substrate, and at least one offset spacer attached between the microelectronic substrate and the heat dissipation device to control the bondline thickness between the heat dissipation device and at least one of the plurality of microelectronic devices.

公开(公告)号：US11652018B2

公开(公告)日：2023-05-16

申请号：US17343565

申请日：2021-06-09

Applicant: Intel Corporation

Inventor： Dinesh P. R. Thanu ,  Hemanth K. Dhavaleswarapu ,  John J. Beatty ,  Syadwad Jain ,  Nachiket R. Raravikar

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/367 ,  H01L23/3142 ,  H01L23/3675 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/81

Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.

公开(公告)号：US20210305118A1

公开(公告)日：2021-09-30

申请号：US17343565

申请日：2021-06-09

Applicant: Intel Corporation

Inventor： Dinesh P. R. Thanu ,  Hemanth K. Dhavaleswarapu ,  John J. Beatty ,  Syadwad Jain ,  Nachiket R. Raravikar

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.

公开(公告)号：US20190067153A1

公开(公告)日：2019-02-28

申请号：US15689463

申请日：2017-08-29

Applicant: Intel Corporation

Inventor： Dinesh P. R. Thanu ,  Hemanth K. Dhavaleswarapu ,  John J. Beatty ,  Syadwad Jain ,  Nachiket R. Raravikar

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.