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公开(公告)号：US11676873B2
公开(公告)日：2023-06-13
申请号：US16614765
申请日：2017-06-30
Applicant: Intel Corporation
Inventor： Dinesh Padmanabhan Ramalekshmi Thanu , Hemanth K. Dhavaleswarapu , Venkata Suresh Guthikonda , John J. Beatty , Yonghao An , Marco Aurelio Cartas Ayala , Luke J. Garner , Peng Li
IPC: H01L23/16 , H01L21/52 , H01L23/367 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/16 , H01L23/00 , H01L25/18
CPC classification number: H01L23/16 , H01L21/52 , H01L23/3675 , H01L23/49816 , H01L23/5383 , H01L25/0655 , H01L25/165 , H01L24/32 , H01L24/48 , H01L25/18 , H01L2224/32245 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2924/19041 , H01L2924/19105
Abstract: Semiconductor packages having a sealant bridge between an integrated heat spreader and a package substrate are described. In an embodiment, a semiconductor package includes a sealant bridge anchoring the integrated heat spreader to the package substrate at locations within an overhang gap laterally between a semiconductor die and a sidewall of the integrated heat spreader. The sealant bridge extends between a top wall of the integrated heat spreader and a die side component, such as a functional electronic component or a non-functional component, or a satellite chip on the package substrate. The sealant bridge modulates warpage or stress in thermal interface material joints to reduce thermal degradation of the semiconductor package.
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公开(公告)号：US20180350712A1
公开(公告)日：2018-12-06
申请号：US15610327
申请日：2017-05-31
Applicant: INTEL CORPORATION
Inventor： Dinesh P. R. Thanu , Hemanth K. Dhavaleswarapu , John J. Beatty , Sachin Deshmukh
IPC: H01L23/36 , H01L23/498 , H01L21/48
Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, a plurality of microelectronic devices attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one of the plurality of microelectronic devices and attached to the microelectronic substrate, and at least one offset spacer attached between the microelectronic substrate and the heat dissipation device to control the bondline thickness between the heat dissipation device and at least one of the plurality of microelectronic devices.
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公开(公告)号：US20170092564A1
公开(公告)日：2017-03-30
申请号：US14864433
申请日：2015-09-24
Applicant: Intel Corporation
Inventor： Siddarth Kumar , Hemanth K. Dhavaleswarapu
IPC: H01L23/473 , H01L23/538 , H01L25/065 , H01L21/48
CPC classification number: H01L23/473 , H01L21/4882 , H01L23/145 , H01L23/5384 , H01L23/5387 , H01L25/0655 , H01L25/0657 , H01L2225/06548 , H01L2225/06589
Abstract: Disclosed herein are systems and methods for thermal management of a flexible integrated circuit (IC) package. In some embodiments, a flexible IC package may include a flexible substrate material; a component disposed in the flexible substrate material; a channel disposed in the flexible substrate material forming a closed circuit and having a portion proximate to the component; electrodes disposed in the flexible substrate material and positioned at locations proximate to the channel, wherein the electrodes are coupled to an electrode controller to selectively cause one or more of the electrodes to generate an electric field; and an electrolytic fluid disposed in the channel. In some embodiments, a flexible IC package may be coupled to a wearable support structure. Other embodiments may be disclosed and/or claimed.
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公开(公告)号：US10580717B2
公开(公告)日：2020-03-03
申请号：US15774990
申请日：2016-01-11
Applicant: Intel Corporation
Inventor： Boxi Liu , Hemanth K. Dhavaleswarapu , Syadwad Jain , James C. Matayabas, Jr.
IPC: H01L23/373 , H01L23/367 , H01L25/065 , H01L25/18 , H01L23/42 , H01L23/00 , H01L23/48 , H01L21/48 , H01L23/498 , H01L23/15 , H01L23/538
Abstract: A multiple chip package is described with multiple thermal interface materials. In one example, a package has a substrate, a first semiconductor die coupled to the substrate, a second semiconductor die coupled to the substrate, a heat spreader coupled to the die, wherein the first die has a first distance to the heat spreader and the second die has a second distance to the heat spreader, a first filled thermal interface material (TIM) between the first die and the heat spreader to mechanically and thermally couple the heat spreader to the die, and a second filled TIM between the second die and the heat spreader to mechanically and thermally couple the heat spreader to the second die.
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公开(公告)号：US09735089B2
公开(公告)日：2017-08-15
申请号：US14864433
申请日：2015-09-24
Applicant: Intel Corporation
Inventor： Siddarth Kumar , Hemanth K. Dhavaleswarapu
IPC: H01L23/34 , H01L23/473 , H01L21/48 , H01L23/538 , H01L25/065
CPC classification number: H01L23/473 , H01L21/4882 , H01L23/145 , H01L23/5384 , H01L23/5387 , H01L25/0655 , H01L25/0657 , H01L2225/06548 , H01L2225/06589
Abstract: Disclosed herein are systems and methods for thermal management of a flexible integrated circuit (IC) package. In some embodiments, a flexible IC package may include a flexible substrate material; a component disposed in the flexible substrate material; a channel disposed in the flexible substrate material forming a closed circuit and having a portion proximate to the component; electrodes disposed in the flexible substrate material and positioned at locations proximate to the channel, wherein the electrodes are coupled to an electrode controller to selectively cause one or more of the electrodes to generate an electric field; and an electrolytic fluid disposed in the channel. In some embodiments, a flexible IC package may be coupled to a wearable support structure. Other embodiments may be disclosed and/or claimed.
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Patent Agency Ranking
公开(公告)号：US11652018B2
公开(公告)日：2023-05-16
申请号：US17343565
申请日：2021-06-09
Applicant: Intel Corporation
Inventor： Dinesh P. R. Thanu , Hemanth K. Dhavaleswarapu , John J. Beatty , Syadwad Jain , Nachiket R. Raravikar
IPC: H01L23/34 , H01L23/367 , H01L23/498 , H01L23/00 , H01L23/31
CPC classification number: H01L23/367 , H01L23/3142 , H01L23/3675 , H01L23/49833 , H01L24/17 , H01L24/81
Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.
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公开(公告)号：US20210305118A1
公开(公告)日：2021-09-30
申请号：US17343565
申请日：2021-06-09
Applicant: Intel Corporation
Inventor： Dinesh P. R. Thanu , Hemanth K. Dhavaleswarapu , John J. Beatty , Syadwad Jain , Nachiket R. Raravikar
IPC: H01L23/367 , H01L23/498 , H01L23/00 , H01L23/31
Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.
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8.发明申请公开(公告)号：US20190067153A1
公开(公告)日：2019-02-28
申请号：US15689463
申请日：2017-08-29
Applicant: Intel Corporation
Inventor： Dinesh P. R. Thanu , Hemanth K. Dhavaleswarapu , John J. Beatty , Syadwad Jain , Nachiket R. Raravikar
IPC: H01L23/367 , H01L23/498 , H01L23/00 , H01L23/31
Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.
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9.发明授权公开(公告)号：US09943931B2
公开(公告)日：2018-04-17
申请号：US15221102
申请日：2016-07-27
Applicant: Intel Corporation
Inventor： Zhihua Li , Hemanth K. Dhavaleswarapu , Joseph B. Petrini , Shankar Devasenathipathy , Steven B. Roach , Ioan Sauciuc , Pranav K. Desai , George S. Kostiew , Sanjoy K. Saha
CPC classification number: B23K37/003 , B23K3/085 , B23K20/023 , F25B21/02 , F25B2321/0251 , H01L24/13 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/291 , H01L2224/75252 , H01L2224/75301 , H01L2224/75502 , H01L2224/81203 , H01L2224/83203 , H05K3/34 , H01L2924/014
Abstract: Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
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10.发明授权公开(公告)号：US11062970B2
公开(公告)日：2021-07-13
申请号：US15689463
申请日：2017-08-29
Applicant: Intel Corporation
Inventor： Dinesh P. R. Thanu , Hemanth K. Dhavaleswarapu , John J. Beatty , Syadwad Jain , Nachiket R. Raravikar
IPC: H01L23/34 , H01L23/367 , H01L23/498 , H01L23/00 , H01L23/31
Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.
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