公开(公告)号：US20190037708A1

公开(公告)日：2019-01-31

申请号：US16072367

申请日：2016-04-01

Applicant: INTEL CORPORATION

Inventor： Sandeep SANE ,  Timothy SWETTLEN

IPC: H05K3/40 ,  H01L23/498 ,  H05K3/34

CPC classification number: H05K3/4015 ,  H01L23/32 ,  H01L23/49816 ,  H01L23/49833 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/09509 ,  H05K2201/10734

Abstract: The systems and methods described herein are directed to using a plurality of interface elements (e.g., sockets) and/or stud-bump elements embedded into board substrates (e.g., a motherboard) to enable the interchange of variable configuration components (e.g., electronic components, chips, and the like) that are mounted on package substrates having ball grid arrays (BGAs). In some aspects, this interchange can be accomplished while leaving the pre-existing board substrate design and various peripheral system components of the board substrate unchanged.