公开(公告)号：US20220151470A1

公开(公告)日：2022-05-19

申请号：US17524183

申请日：2021-11-11

Applicant: INTUITIVE SURGICAL OPERATIONS, INC

Inventor： Viraj A. Patwardhan ,  Matthew M. McConnell ,  Parthasarathy Srinivasarajan

IPC: A61B1/00 ,  A61B1/05

Abstract: An endoscopic imaging instrument comprises an optical assembly and a sensor module coupled to the optical assembly. The sensor module comprises a plurality of electronic components and a seal member. The seal member includes an interior surface defining a hermetic cavity. The plurality of electronic components are positioned within the hermetic cavity. The seal member further includes an exterior surface and a wall extending between the interior surface and the exterior surface. The seal member further includes a plurality of connectors within the wall. Each connector of the plurality of connectors is configured to electrically connect with one or more electronic components of the plurality of electronic components.

公开(公告)号：US10575714B2

公开(公告)日：2020-03-03

申请号：US16316696

申请日：2017-05-15

Applicant: INTUITIVE SURGICAL OPERATIONS, INC.

Inventor： Viraj A. Patwardhan ,  John A Barton ,  Mathew Clopp ,  John E. Sell

IPC: A61B1/05 ,  A61B1/00 ,  A61B1/313 ,  A61B90/00 ,  A61B34/30 ,  A61B34/35 ,  A61B1/12 ,  A61B90/30

Abstract: A binocular image capture device includes a plurality of stacked circuit boards, a front-facing dual image sensor mounted to a first circuit board of the plurality of stacked circuit boards, and signal conditioning electronics mounted to one or more of the plurality of stacked circuit boards and coupled to receive electrical signals generated by the dual image sensor. The dual image sensor is enclosed in a hermetic housing. In some examples, the hermetic housing may be formed by the first circuit board, a transition ring secured to the first circuit board, and an optics mount secured to the transition ring. In some examples, the hermetic housing may be formed using materials having matching coefficients of thermal expansion. In some examples, the binocular image capture device is enclosed by a shaft, the plurality of stacked circuit boards being stacked along a length of the shaft.

公开(公告)号：US20190150716A1

公开(公告)日：2019-05-23

申请号：US16316696

申请日：2017-05-15

Applicant: INTUITIVE SURGICAL OPERATIONS, INC.

Inventor： Viraj A. Patwardhan ,  John A. Barton ,  Mathew Clopp ,  John E. Sell

IPC: A61B1/00 ,  A61B1/05 ,  A61B34/35 ,  A61B1/313 ,  A61B1/12

Abstract: A binocular image capture device includes a plurality of stacked circuit boards, a front-facing dual image sensor mounted to a first circuit board of the plurality of stacked circuit boards, and signal conditioning electronics mounted to one or more of the plurality of stacked circuit boards and coupled to receive electrical signals generated by the dual image sensor. The dual image sensor is enclosed in a hermetic housing. In some examples, the hermetic housing may be formed by the first circuit board, a transition ring secured to the first circuit board, and an optics mount secured to the transition ring. In some examples, the hermetic housing may be formed using materials having matching coefficients of thermal expansion. In some examples, the binocular image capture device is enclosed by a shaft, the plurality of stacked circuit boards being stacked along a length of the shaft.

公开(公告)号：US20200214545A1

公开(公告)日：2020-07-09

申请号：US16787447

申请日：2020-02-11

Applicant: INTUITIVE SURGICAL OPERATIONS, INC.

Inventor： Viraj A. Patwardhan ,  John A Barton ,  Mathew Clopp ,  John E. Sell

IPC: A61B1/00 ,  A61B1/313 ,  A61B1/05 ,  A61B90/00 ,  A61B34/30 ,  A61B34/35 ,  A61B1/12

Abstract: A binocular image capture device includes a plurality of stacked circuit boards, a front-facing dual image sensor mounted to a first circuit board of the plurality of stacked circuit boards, and signal conditioning electronics mounted to one or more of the plurality of stacked circuit boards and coupled to receive electrical signals generated by the dual image sensor. The dual image sensor is enclosed in a hermetic housing. In some examples, the hermetic housing may be formed by the first circuit board, a transition ring secured to the first circuit board, and an optics mount secured to the transition ring. In some examples, the hermetic housing may be formed using materials having matching coefficients of thermal expansion. In some examples, the binocular image capture device is enclosed by a shaft, the plurality of stacked circuit boards being stacked along a length of the shaft.

公开(公告)号：US11206967B2

公开(公告)日：2021-12-28

申请号：US16787447

申请日：2020-02-11

Applicant: INTUITIVE SURGICAL OPERATIONS, INC.

Inventor： Viraj A. Patwardhan ,  John A Barton ,  Mathew Clopp ,  John E. Sell

IPC: H04N7/18 ,  A61B1/00 ,  A61B1/313 ,  A61B1/05 ,  A61B90/00 ,  A61B34/30 ,  A61B34/35 ,  A61B1/12 ,  A61B90/30

Abstract: An image capture device includes a plurality of stacked ceramic circuit boards, an image sensor, signal conditioning electronics, and a connector. Each ceramic circuit board is parallel and directly coupled to at least one other circuit board. The image sensor is mounted to a first ceramic circuit board. The signal conditioning electronics are mounted to one or more of the stacked ceramic circuit boards and are coupled to receive electrical signals generated by the image sensor. The image capture device is enclosed by a shaft and the stacked ceramic circuit boards are stacked along a length of the shaft. The connector is mounted to a second ceramic circuit board that is on an opposite side of the plurality of stacked ceramic circuit boards from the first ceramic circuit board. The connector is mounted to a side of the second ceramic circuit board facing away from the first ceramic circuit board.