SYSTEMS AND METHODS FOR HIGH-SPEED DATA TRANSMISSION ACROSS AN ELECTRICAL ISOLATION BARRIER

    公开(公告)号:US20230284875A1

    公开(公告)日:2023-09-14

    申请号:US18199045

    申请日:2023-05-18

    Abstract: An illustrative system includes first and second electrical circuits, a free space optics interface assembly, and a feedthrough assembly. The free space optics interface assembly may include an optical transmitter having an input that is electrically coupled to the first electrical circuit, and an optical receiver having an output that is electrically coupled to the second electrical circuit. The feedthrough assembly electrically connects the input of the optical transmitter to the first electrical circuit and includes a first conductive receptacle electrically coupled to a first input pin of the optical transmitter, a second conductive receptacle electrically coupled to a second input pin of the optical transmitter, a first conductive pad providing electrical connection of the first input pin of the optical transmitter to the first electrical circuit, and a second conductive pad providing electrical connection of the second input pin of the optical transmitter to the first electrical circuit.

    COMPACT BINOCULAR IMAGE CAPTURE DEVICE
    9.
    发明申请

    公开(公告)号:US20190150716A1

    公开(公告)日:2019-05-23

    申请号:US16316696

    申请日:2017-05-15

    Abstract: A binocular image capture device includes a plurality of stacked circuit boards, a front-facing dual image sensor mounted to a first circuit board of the plurality of stacked circuit boards, and signal conditioning electronics mounted to one or more of the plurality of stacked circuit boards and coupled to receive electrical signals generated by the dual image sensor. The dual image sensor is enclosed in a hermetic housing. In some examples, the hermetic housing may be formed by the first circuit board, a transition ring secured to the first circuit board, and an optics mount secured to the transition ring. In some examples, the hermetic housing may be formed using materials having matching coefficients of thermal expansion. In some examples, the binocular image capture device is enclosed by a shaft, the plurality of stacked circuit boards being stacked along a length of the shaft.

Patent Agency Ranking