Sealing a fiber bundle end with glass fritting

    公开(公告)号:US10598868B2

    公开(公告)日:2020-03-24

    申请号:US16459452

    申请日:2019-07-01

    Inventor: Mathew Clopp

    Abstract: An apparatus comprises a housing having a first melting temperature and a fiber bundle extending through the housing. The fiber bundle comprises a plurality of fibers having a second melting temperature. An end of each of the plurality of fibers extends past an edge of the housing. The apparatus further comprises a first seal between the plurality of fibers themselves and a second seal between the plurality of fibers and an inner surface of the housing. The seals each comprise a glass material having a third melting temperature lower than the first two melting temperatures. The second seal is configured to be formed as a result of the fiber bundle being inserted into the housing. The glass material coats a tip of each of the plurality of fibers and at least a portion of a side of each of the plurality of fibers near an end of the fiber bundle.

    Compact binocular image capture device

    公开(公告)号:US10575714B2

    公开(公告)日:2020-03-03

    申请号:US16316696

    申请日:2017-05-15

    Abstract: A binocular image capture device includes a plurality of stacked circuit boards, a front-facing dual image sensor mounted to a first circuit board of the plurality of stacked circuit boards, and signal conditioning electronics mounted to one or more of the plurality of stacked circuit boards and coupled to receive electrical signals generated by the dual image sensor. The dual image sensor is enclosed in a hermetic housing. In some examples, the hermetic housing may be formed by the first circuit board, a transition ring secured to the first circuit board, and an optics mount secured to the transition ring. In some examples, the hermetic housing may be formed using materials having matching coefficients of thermal expansion. In some examples, the binocular image capture device is enclosed by a shaft, the plurality of stacked circuit boards being stacked along a length of the shaft.

    Sealing a fiber bundle end with glass fritting

    公开(公告)号:US10379297B2

    公开(公告)日:2019-08-13

    申请号:US15956942

    申请日:2018-04-19

    Inventor: Mathew Clopp

    Abstract: A method comprises applying a frit material having a first melting temperature to an end of each fiber of a plurality of fibers in a fiber bundle having a second melting temperature to coat a tip of each fiber with the frit material and at least a portion of a side of each fiber near an end of the fiber bundle; inserting the fiber bundle into a housing such that the tip of each fiber in the fiber bundle extends past an edge of an end portion of the housing and the frit material forms a seal between the fiber bundle and an inner surface of the end portion of the housing; and heating the frit material to bind the frit material to the plurality of fibers without melting the plurality of fibers in the fiber bundle and to create a seal between the plurality of fibers.

    COMPACT BINOCULAR IMAGE CAPTURE DEVICE
    6.
    发明申请

    公开(公告)号:US20190150716A1

    公开(公告)日:2019-05-23

    申请号:US16316696

    申请日:2017-05-15

    Abstract: A binocular image capture device includes a plurality of stacked circuit boards, a front-facing dual image sensor mounted to a first circuit board of the plurality of stacked circuit boards, and signal conditioning electronics mounted to one or more of the plurality of stacked circuit boards and coupled to receive electrical signals generated by the dual image sensor. The dual image sensor is enclosed in a hermetic housing. In some examples, the hermetic housing may be formed by the first circuit board, a transition ring secured to the first circuit board, and an optics mount secured to the transition ring. In some examples, the hermetic housing may be formed using materials having matching coefficients of thermal expansion. In some examples, the binocular image capture device is enclosed by a shaft, the plurality of stacked circuit boards being stacked along a length of the shaft.

    COMPACT BINOCULAR IMAGE CAPTURE DEVICE
    8.
    发明申请

    公开(公告)号:US20200214545A1

    公开(公告)日:2020-07-09

    申请号:US16787447

    申请日:2020-02-11

    Abstract: A binocular image capture device includes a plurality of stacked circuit boards, a front-facing dual image sensor mounted to a first circuit board of the plurality of stacked circuit boards, and signal conditioning electronics mounted to one or more of the plurality of stacked circuit boards and coupled to receive electrical signals generated by the dual image sensor. The dual image sensor is enclosed in a hermetic housing. In some examples, the hermetic housing may be formed by the first circuit board, a transition ring secured to the first circuit board, and an optics mount secured to the transition ring. In some examples, the hermetic housing may be formed using materials having matching coefficients of thermal expansion. In some examples, the binocular image capture device is enclosed by a shaft, the plurality of stacked circuit boards being stacked along a length of the shaft.

    Sealing a Fiber Bundle End With Glass Fritting

    公开(公告)号:US20190324216A1

    公开(公告)日:2019-10-24

    申请号:US16459452

    申请日:2019-07-01

    Inventor: Mathew Clopp

    Abstract: An apparatus comprising a housing and a fiber bundle extending through the housing. The fiber bundle is comprised of a plurality of fibers. The apparatus also comprises a seal between the plurality of fibers and between the plurality of fibers and an inner surface of the housing. The seal comprises a glass material having a lower melting temperature than the plurality of fibers.

    Compact binocular image capture device

    公开(公告)号:US11206967B2

    公开(公告)日:2021-12-28

    申请号:US16787447

    申请日:2020-02-11

    Abstract: An image capture device includes a plurality of stacked ceramic circuit boards, an image sensor, signal conditioning electronics, and a connector. Each ceramic circuit board is parallel and directly coupled to at least one other circuit board. The image sensor is mounted to a first ceramic circuit board. The signal conditioning electronics are mounted to one or more of the stacked ceramic circuit boards and are coupled to receive electrical signals generated by the image sensor. The image capture device is enclosed by a shaft and the stacked ceramic circuit boards are stacked along a length of the shaft. The connector is mounted to a second ceramic circuit board that is on an opposite side of the plurality of stacked ceramic circuit boards from the first ceramic circuit board. The connector is mounted to a side of the second ceramic circuit board facing away from the first ceramic circuit board.

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