公开(公告)号：US20230164912A1

公开(公告)日：2023-05-25

申请号：US18094995

申请日：2023-01-10

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/02

CPC classification number: H05K1/0269 ,  H05K3/46 ,  H05K3/022

Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.

公开(公告)号：US20250118605A1

公开(公告)日：2025-04-10

申请号：US18981693

申请日：2024-12-16

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Kuang-Chiang HUANG ,  Yu-Ting LIU ,  Hi-Hung LIN ,  Cheng-En CHENG

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/58 ,  H01L25/18

Abstract: An electronic device is provided and includes a first conductive structure, a second conductive structure, a third conductive structure, a first insulating layer, a second insulating layer, a conductive element, an electronic component, and a plurality of passive components. The first insulating layer is disposed between the first conductive structure and the second conductive structure, and the second insulating layer is disposed between the second conductive structure and the third conductive structure. The second conductive structure is electrically connected to the first conductive structure at a first position, and the third conductive structure is electrically connected to the second conductive structure at a second position, wherein a center point of the first position and a center point of the second position is misaligned along a normal direction of a surface of the first insulating layer.

公开(公告)号：US20220334423A1

公开(公告)日：2022-10-20

申请号：US17698216

申请日：2022-03-18

Applicant: InnoLux Corporation

Inventor： Bi-Ly LIN ,  Yeong-E CHEN

IPC: G02F1/133 ,  G02F1/1343 ,  G02F1/29 ,  H01L31/054 ,  G02C7/06

Abstract: An electronic device includes a solar cell, a first light modulating layer, a transmittance-adjustable lens and a control circuit. At least a portion of the first light modulating layer is disposed on the solar cell. The control circuit is electrically connected to the solar cell and the transmittance-adjustable lens.

公开(公告)号：US20220330430A1

公开(公告)日：2022-10-13

申请号：US17851246

申请日：2022-06-28

Applicant: InnoLux Corporation

Inventor： Yu-Ting LIU ,  Yeong-E CHEN ,  Chean KEE

IPC: H05K1/11

Abstract: An electronic device is provided. The electronic device includes: a substrate, wherein the substrate has a normal direction; a first bonding pad and a second bonding pad disposed side by side on the substrate. The first bonding pad includes a first conductive layer and a second conductive layer, and the first conductive layer is adjacent to the second conductive layer. The second bonding pad includes a third conductive layer, the third conductive layer is adjacent to the second conductive layer, and in the normal direction, a distance between a bottom surface of the third conductive layer and the substrate is different than a distance between a bottom surface of the second conductive layer and the substrate. Viewed from the normal direction of the substrate, at least part of the second conductive layer is between the first conductive layer and the third conductive layer.

公开(公告)号：US20220167495A1

公开(公告)日：2022-05-26

申请号：US17313006

申请日：2021-05-06

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H05K1/02 ,  H05K3/02 ,  H05K3/46

Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer including a first dielectric layer, a conductive layer, and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test mark, the test mark includes a plurality of conductive patterns formed of the conductive layer, and the conductive patterns are arranged in a ring shape.

公开(公告)号：US20220157703A1

公开(公告)日：2022-05-19

申请号：US17572657

申请日：2022-01-11

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H01L23/498 ,  H01L21/48

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes a redistribution layer which includes a first dielectric layer, a conductive layer and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern that includes a first conductive pattern, and the first conductive pattern is formed of the conductive layer.

公开(公告)号：US20240389229A1

公开(公告)日：2024-11-21

申请号：US18787397

申请日：2024-07-29

Applicant: InnoLux Corporation

Inventor： Yu-Ting LIU ,  Yeong-E CHEN ,  Chean KEE

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

Abstract: An electronic device includes a substrate, a first conductive structure, a second conductive structure, a first wire, and a second wire. The substrate includes a peripheral region. The first conductive structure is in the peripheral region and includes a first conductive layer and a second conductive layer. The first and the second conductive layer are arranged along a first direction. The second conductive structure is in the peripheral region and includes a third conductive layer. The first and the second conductive structure are arranged along a second direction, which is perpendicular to the first direction. The first wire is in the peripheral region and is electrically connected between the first and the third conductive layer. The second wire is in the peripheral region and is electrically connected to the second conductive layer. The first wire is adjacent to the second wire along the first direction.

公开(公告)号：US20230095239A1

公开(公告)日：2023-03-30

申请号：US18074525

申请日：2022-12-05

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Yeong-E CHEN ,  Cheng-En CHENG

IPC: H01L21/768 ,  H01L21/683 ,  H01L21/288 ,  H01L21/027 ,  H01L21/48 ,  H01L21/66

Abstract: The present disclosure discloses a method for manufacturing an electronic device, including: setting a basic working area; a photoresist coating process; a development process; an etching process; an exposure process; a metal plating process; and a polishing process, wherein the photoresist coating process, the development process, the etching process, the exposure process, the metal plating process and the polishing process respectively have a maximum optimized process area, and a smallest one of the maximum optimized process areas is selected as the basic working area.

公开(公告)号：US20230038309A1

公开(公告)日：2023-02-09

申请号：US17736112

申请日：2022-05-04

Applicant: InnoLux Corporation

Inventor： Yi-Hung LIN ,  Chun-Hung LAI ,  Yeong-E CHEN ,  Chuan-Ming YEH ,  Ching-Wei CHEN

IPC: H05K1/02

Abstract: A package device is provided and includes a first circuit layer, a first isolation layer, and a first de-warpage layer. The first circuit layer and the first isolation layer are stacked on each other. At least a portion of the first de-warpage layer is disposed between the first circuit layer and the first isolation layer.

公开(公告)号：US20220165628A1

公开(公告)日：2022-05-26

申请号：US17315389

申请日：2021-05-10

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Kuang-Chiang HUANG ,  Yu-Ting LIU ,  Yi-Hung LIN ,  Cheng-En CHENG

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/48

Abstract: The present disclosure provides a manufacturing method of a package device, which includes providing a carrier substrate, a first conductive layer, and a release layer, where the carrier substrate has a device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. The method further includes forming a second conductive layer on the release layer in the device region, where at least one of the first and second conductive layers includes a first pad in the peripheral region. The second conductive layer includes a second pad electrically connected to the first pad through the first conductive layer. The method also includes performing an inspection step to provide an input signal to one of the first and second pads, and to receive an output signal from another of the first and second pads.