公开(公告)号：US20240379495A1

公开(公告)日：2024-11-14

申请号：US18314157

申请日：2023-05-09

Applicant: Intel Corporation

Inventor： Smit KAPILA ,  Sumod CHERUKKATE ,  Abhishek SRIVASTAV ,  Sandesh Geejagaaru KRISHNAMURTHY ,  Sankarananda BASAK ,  Ellann COHEN ,  Jerrod PETERSON

IPC: H01L23/373 ,  H05K1/02

Abstract: The present disclosure is directed to monitoring the integrity of the thermal interface material (TIM) of a semiconductor device directly by a monitoring component of a motherboard, a system on chip (SOC), or a remote device to measure either the electrical resistivity or capacitive property of the TIM, depending on the type of TIM being used, as a means to directly assess the thermal properties (conductivity, resistance, and/or impedance) of the TIM as it ages. In an aspect, the electrical resistivity or capacitive property of the TIM may be initially measured and charted, and thereafter, the changes in the electrical resistivity or capacitive property may be sensed by the monitoring component and, based on the delta of those changes, there may be remedial actions taken to mitigate impacts to the overall system performance and/or to prevent irreparable damage to the semiconductor device/system.

公开(公告)号：US20250003424A1

公开(公告)日：2025-01-02

申请号：US18399686

申请日：2023-12-29

Applicant: Intel Corporation

Inventor： Abhishek SRIVASTAV ,  Smit KAPILA ,  Pawel TRELLA ,  Jeff KU ,  Prakash KURMA RAJU ,  Dominik STANCZAK

IPC: F04D29/46 ,  F04D29/42 ,  F04D29/58

Abstract: An apparatus and system for reducing air turbulence in a fan using a flow shaper. The fan including an impeller, a first outlet, and a second outlet. The flow shaper including a partition structure arranged at an inflection area between the first outlet and the second outlet. The flow shaper further including a first fin for the first outlet defining a first channel between the partition structure and the first fin. The first channel extending from a proximity of the impeller to the first outlet.

公开(公告)号：US20240194215A1

公开(公告)日：2024-06-13

申请号：US18078051

申请日：2022-12-08

Applicant: Intel Corporation

Inventor： Sumod CHERUKKATE ,  Willem BELTMAN ,  Mallari HANCHATE ,  Srikanth POTLURI ,  Sangeeta MANEPALLI ,  Abhishek SRIVASTAV

IPC: G10L21/0364 ,  G06F3/01 ,  G06T7/50 ,  G06V40/16 ,  H04R1/32

CPC classification number: G10L21/0364 ,  G06F3/013 ,  G06T7/50 ,  G06V40/172 ,  H04R1/326

Abstract: This disclosure describes systems, methods, and devices related to user tracking. A device may identify metadata comprising depth sensing information and camera information received from an in-room device located at a first location having a first camera. The device may perform face recognition on one or more in-room users. The device may calculate a distance of a first in-room user based on the metadata and a first number of pixels across the face of the first in-room user. The device may calculate a distance between the first in-room user and a second in-room user based on the metadata and the first number of pixels across the face of the first in-room user and a number of pixels across the face of the second in-room user.

公开(公告)号：US20230024409A1

公开(公告)日：2023-01-26

申请号：US17903278

申请日：2022-09-06

Applicant: Intel Corporation

Inventor： Smit KAPILA ,  Prakash Kurma RAJU ,  Abhishek SRIVASTAV ,  Prasanna PICHUMANI ,  Raghavendra Subramanya Setty KANIVIHALLI

IPC: H05K7/20 ,  G06F1/20 ,  G10K11/16

Abstract: A noise suppressing heat exchanger (also referred to as heat sink) includes a plurality of heat dissipating fins formed with baffles. The baffles suppress noise from a fan by slowing air flow and creating internal reflections within the heat exchanger that reflect noise away from the air flow path, absorbing sound energy and potentially setting up standing waves which dissipate noise via destructive interference. Other embodiments may be described and/or claimed.