公开(公告)号：US20220199503A1

公开(公告)日：2022-06-23

申请号：US17129846

申请日：2020-12-21

Applicant: Intel Corporation

Inventor： Manish DUBEY ,  Guruprasad ARAKERE ,  Deepak KULKARNI ,  Sairam AGRAHARAM ,  Wei-Lun K. JEN ,  Numair AHMED ,  Kousik GANESAN ,  Amol D. JADHAV ,  Kyu-Oh LEE

IPC: H01L23/498 ,  H01L21/48

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate with a die side and a land side. In an embodiment, a pad is on the land side. In an embodiment, a dielectric layer covers sidewalls of the pad, and a surface finish is over an exposed surface of the pad.