公开(公告)号：US11749585B2

公开(公告)日：2023-09-05

申请号：US16805392

申请日：2020-02-28

Applicant: Intel Corporation

Inventor： Yiqun Bai ,  Vipul Mehta ,  John Decker ,  Ziyin Lin

IPC: H01L23/31 ,  H01L23/433 ,  H01L21/56 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/4334 ,  H01L21/56 ,  H01L23/3185 ,  H01L25/0655 ,  H01L25/50

Abstract: An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a mold material layer abutting electronic substrate and substantially surrounding the at least one integrated circuit, and at least one structure within the mold material layer, wherein the at least one structure comprises a material having a modulus of greater than about 20 gigapascals and a thermal conductivity of greater than about 10 watts per meter-Kelvin.

公开(公告)号：US11688634B2

公开(公告)日：2023-06-27

申请号：US16526012

申请日：2019-07-30

Applicant: Intel Corporation

Inventor： Vipul Mehta ,  Yiqun Bai ,  Ziyin Lin ,  John Decker ,  Yan Li

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/768 ,  H01L23/373 ,  H01L23/367

CPC classification number: H01L21/76877 ,  H01L21/565 ,  H01L21/76804 ,  H01L23/3107 ,  H01L23/367 ,  H01L23/373

Abstract: Embodiments disclosed herein include composite dies and methods of forming such composite dies. In an embodiment, a composite die comprises a base substrate, a first die over the base substrate, and a second die over the base substrate and adjacent to the first die. In an embodiment an underfill layer is between the first die and the base substrate, between the second die and the base substrate, and between the first die and the second die. In an embodiment, a trench into the underfill layer is between the first die and the second die. In an embodiment the composite die further comprises, a mold layer over the first die and the second die, wherein the mold layer fills the trench.

公开(公告)号：US20210272878A1

公开(公告)日：2021-09-02

申请号：US16805392

申请日：2020-02-28

Applicant: Intel Corporation

Inventor： Yiqun Bai ,  Vipul Mehta ,  John Decker ,  Ziyin Lin

IPC: H01L23/433 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56

Abstract: An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a mold material layer abutting electronic substrate and substantially surrounding the at least one integrated circuit, and at least one structure within the mold material layer, wherein the at least one structure comprises a material having a modulus of greater than about 20 gigapascals and a thermal conductivity of greater than about 10 watts per meter-Kelvin.