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Patent Agency Ranking
1.发明授权公开(公告)号：US11100032B2
公开(公告)日：2021-08-24
申请号：US16780713
申请日：2020-02-03
Applicant: Intel Corporation
Inventor： David Browning , Brandon Courtney , John Eley
Abstract: An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.
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2.发明申请公开(公告)号：US20190042516A1
公开(公告)日：2019-02-07
申请号：US16157989
申请日：2018-10-11
Applicant: Intel Corporation
Inventor： David Browning , Brandon Courtney , John Eley
Abstract: An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.
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公开(公告)号：US20190157253A1
公开(公告)日：2019-05-23
申请号：US16254403
申请日：2019-01-22
Applicant: Intel Corporation
Inventor： David Browning , John Eley
Abstract: A circuit system includes an integrated circuit package, first and second memory modules, and a base circuit board. The integrated circuit package houses a main integrated circuit die. The first memory module has a first circuit board and first memory integrated circuit dies coupled to the first circuit board. The second memory module has a second circuit board and second memory integrated circuit dies coupled to the second circuit board. The base circuit board is coupled to the integrated circuit package and to the first and second memory modules. The base circuit board includes conductors that couple the integrated circuit package to the first and second memory modules. The second memory module has a reverse orientation on the base circuit board relative to the first memory module such that the second memory integrated circuit dies face away from the first memory integrated circuit dies.
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4.发明申请公开(公告)号：US20200174959A1
公开(公告)日：2020-06-04
申请号：US16780713
申请日：2020-02-03
Applicant: Intel Corporation
Inventor： David Browning , Brandon Courtney , John Eley
Abstract: An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.
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5.发明授权公开(公告)号：US10572430B2
公开(公告)日：2020-02-25
申请号：US16157989
申请日：2018-10-11
Applicant: Intel Corporation
Inventor： David Browning , Brandon Courtney , John Eley
Abstract: An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.
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