公开(公告)号：US10027160B2

公开(公告)日：2018-07-17

申请号：US15081341

申请日：2016-03-25

Applicant: INTEL CORPORATION

Inventor： Ralph V. Miele ,  David G. Payne ,  Brandon Courtney ,  Isaac A. Simpson ,  Andrew Larson ,  David Pidwerbecki ,  Patrick Chewning

IPC: H02J7/02 ,  H04B5/00

Abstract: A method is provided for forming a wireless charging electronic device. An embodiment of the method includes integrating a coil and a collector plate to a chassis of the electronic device to wirelessly charge the electronic device.

公开(公告)号：USD1065180S1

公开(公告)日：2025-03-04

申请号：US29881262

申请日：2022-12-29

Applicant: Intel Corporation

Designer： Andrew Hooper ,  Brandon Courtney ,  David M. Collins ,  Michael Hyde ,  Steven Mardis Bagley ,  Nadezhda Kutyreva ,  Phnam Bagley ,  Diana Hilson

公开(公告)号：US20190042516A1

公开(公告)日：2019-02-07

申请号：US16157989

申请日：2018-10-11

Applicant: Intel Corporation

Inventor： David Browning ,  Brandon Courtney ,  John Eley

IPC: G06F13/40 ,  G06F13/16 ,  H05K1/18 ,  G06F1/20

Abstract: An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.

公开(公告)号：US11100032B2

公开(公告)日：2021-08-24

申请号：US16780713

申请日：2020-02-03

Applicant: Intel Corporation

Inventor： David Browning ,  Brandon Courtney ,  John Eley

IPC: G06F13/40 ,  G06F13/16 ,  H05K1/18 ,  G06F1/20 ,  H05K1/02

Abstract: An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.

公开(公告)号：US20200174959A1

公开(公告)日：2020-06-04

申请号：US16780713

申请日：2020-02-03

Applicant: Intel Corporation

Inventor： David Browning ,  Brandon Courtney ,  John Eley

IPC: G06F13/40 ,  H05K1/18 ,  H05K1/02 ,  G06F13/16 ,  G06F1/20

Abstract: An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.

公开(公告)号：US10572430B2

公开(公告)日：2020-02-25

申请号：US16157989

申请日：2018-10-11

Applicant: Intel Corporation

Inventor： David Browning ,  Brandon Courtney ,  John Eley

IPC: G06F13/40 ,  G06F13/16 ,  H05K1/18 ,  G06F1/20 ,  H05K1/02

Abstract: An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.