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公开(公告)号：US12135569B2
公开(公告)日：2024-11-05
申请号：US17133279
申请日：2020-12-23
Applicant: Intel Corporation
Inventor： Rodrigo De Oliveira Vivi , John Kelbert , David Lombard , Eric Moret , Mark Luckeroth , Brad Bittel , Phani Kumar Kandula
Abstract: Methods, apparatus, systems, and articles of manufacture to reduce thermal fluctuations in semiconductor processors are disclosed. An apparatus includes a temperature analyzer to determine a current temperature of a processor. The apparatus further includes a controller to provide an idle workload to the processor to execute in response to the current temperature falling below a setback temperature.
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公开(公告)号：US20230101997A1
公开(公告)日：2023-03-30
申请号：US17490290
申请日：2021-09-30
Applicant: Intel Corporation
Inventor： Nikos Kaburlasos , Rodrigo De Oliveira Vivi , Phani Kumar Kandula , Marc Beuchat , Mark J. Luckeroth , Eric J.M. Moret , David N. Lombard , John Kelbert , Brad Bittel
IPC: G06F1/3296 , G06F1/3228 , G06F1/08
Abstract: Disclosed herein are embodiments of systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices. In an embodiment, a processor includes a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution. The processor also includes temperature-measurement circuitry configured to monitor an on-chip temperature of the processor. The processor also includes control logic configured to: determine whether the processor is active or idle; determine whether the on-chip temperature of the processor exceeds a first threshold; based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second (higher) threshold.
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公开(公告)号：US12253901B2
公开(公告)日：2025-03-18
申请号：US17490290
申请日：2021-09-30
Applicant: Intel Corporation
Inventor： Nikos Kaburlasos , Rodrigo De Oliveira Vivi , Phani Kumar Kandula , Marc Beuchat , Mark J. Luckeroth , Eric J. M. Moret , David N. Lombard , John Kelbert , Brad Bittel
IPC: G06F1/32 , G06F1/08 , G06F1/3228 , G06F1/3296
Abstract: Disclosed herein are embodiments of systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices. In an embodiment, a processor includes a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution. The processor also includes temperature-measurement circuitry configured to monitor an on-chip temperature of the processor. The processor also includes control logic configured to: determine whether the processor is active or idle; determine whether the on-chip temperature of the processor exceeds a first threshold; based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second (higher) threshold.
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公开(公告)号：US20210223805A1
公开(公告)日：2021-07-22
申请号：US17133279
申请日：2020-12-23
Applicant: Intel Corporation
Inventor： Rodrigo De Oliveira Vivi , John Kelbert , David Lombard , Eric Moret , Mark Luckeroth , Brad Bittel , Phani Kumar Kandula
Abstract: Methods, apparatus, systems, and articles of manufacture to reduce thermal fluctuations in semiconductor processors are disclosed. An apparatus includes a temperature analyzer to determine a current temperature of a processor. The apparatus further includes a controller to provide an idle workload to the processor to execute in response to the current temperature falling below a setback temperature.
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