公开(公告)号：US10355384B2

公开(公告)日：2019-07-16

申请号：US15751018

申请日：2015-09-23

Applicant: Intel Corporation

Inventor： Kit Chew Chee ,  Ahmad Jalaluddin Yusof ,  Tin Poay Chuah

IPC: H01R3/00 ,  H01R12/77 ,  H01R12/79 ,  H05K1/11 ,  H01R13/627 ,  H01R107/00 ,  H05K3/46

Abstract: In one example an electronic device comprises a chassis and a printed circuit board coupled to the chassis and comprising a body formed from a plurality of laminate layers, and at least one receptacle formed in the body and comprising at least one data connector positioned in the receptacle to provide a communication connection. Other examples may be described.

公开(公告)号：US20180233841A1

公开(公告)日：2018-08-16

申请号：US15751018

申请日：2015-09-23

Applicant: Intel Corporation

Inventor： Kit Chew Chee ,  Ahmad Jalaluddin Yusof ,  Tin Poay Chuah

IPC: H01R12/77 ,  H01R12/79

CPC classification number: H01R12/774 ,  H01R12/79 ,  H01R13/6275 ,  H01R2107/00 ,  H05K1/117 ,  H05K1/118 ,  H05K3/4697 ,  H05K2201/09127 ,  H05K2201/09163 ,  H05K2201/09481 ,  H05K2201/1034

Abstract: In one example an electronic device comprises a chassis and a printed circuit board coupled to the chassis and comprising a body formed from a plurality of laminate layers, and at least one receptacle formed in the body and comprising at least one data connector positioned in the receptacle to provide a communication connection. Other examples may be described.