公开(公告)号：US09653411B1

公开(公告)日：2017-05-16

申请号：US14974771

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Donglai David Lu ,  Zhaozhi George Li ,  Matthew T. Magnavita ,  Amram Eitan ,  Peng Chen

IPC: H01L23/28 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/563 ,  H01L23/29 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3736 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/37001

Abstract: An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; and a porous coating that includes grains of metal powder formed onto the electronic component by melting the metal powder onto the electronic component. An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; and a porous coating that includes grains of metal powder formed onto the substrate by melting the metal powder onto the substrate. An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; an initial mold covering the electronic component; and a porous coating that includes grains of metal powder formed onto the initial mold by melting the metal powder onto the initial mold.