公开(公告)号：US20170176173A1

公开(公告)日：2017-06-22

申请号：US14973131

申请日：2015-12-17

Applicant: Intel Corporation

Inventor： Yanmei Song ,  Yongmei Liu ,  Deepak Goyal ,  Donglai David Lu ,  Marcel A. Wall

IPC: G01B11/06

CPC classification number: G01B11/065

Abstract: Described herein are devices and techniques for measuring a thickness of a surface layer. A device can include a detector, a processor, and a memory. The detector can be arranged to receive reflected light from a surface of a sample. The processor can be in electrical communication with the detector. The memory can store instructions that, when executed by the processor, can cause the processor to perform operations. The operations can include receiving optical data from the detector, determining a polarization change of the reflected light, the polarization change being a function of the optical data, and determining a thickness of the surface layer using the polarization change and the wavelength of the incident light. The optical data can include information regarding the phase difference of the reflected light and the incident light. Also described are other embodiments.

公开(公告)号：US10297567B2

公开(公告)日：2019-05-21

申请号：US14974823

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Donglai David Lu ,  Jimin Yao ,  Amrita Mallik ,  George S. Kostiew ,  Shawna M. Liff

IPC: H01L23/00

Abstract: Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.

公开(公告)号：US09653411B1

公开(公告)日：2017-05-16

申请号：US14974771

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Donglai David Lu ,  Zhaozhi George Li ,  Matthew T. Magnavita ,  Amram Eitan ,  Peng Chen

IPC: H01L23/28 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/563 ,  H01L23/29 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3736 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/37001

Abstract: An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; and a porous coating that includes grains of metal powder formed onto the electronic component by melting the metal powder onto the electronic component. An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; and a porous coating that includes grains of metal powder formed onto the substrate by melting the metal powder onto the substrate. An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; an initial mold covering the electronic component; and a porous coating that includes grains of metal powder formed onto the initial mold by melting the metal powder onto the initial mold.