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公开(公告)号：US20230299516A1
公开(公告)日：2023-09-21
申请号：US18202194
申请日：2023-05-25
Applicant: Intel Corporation
Inventor： Amarjeet KUMAR , Navneet Kumar SINGH, I , Samarth ALVA , Richard S. PERRY , Christopher WEST
CPC classification number: H01R12/52 , H05K7/20509
Abstract: A back-to-back ultra-slim module (USM) includes an inline USM (USMi) connector and a top mount USM (USMt) connector. The back-to-back USM assembly can be made as a double-sided module to allow a stacked module configuration to save system area. The stacked module has a USMi module inline with the system board on one side of the system board, and a USMt module vertically offset from the other side of the system board. The stacked module can have a thermal layer between the USMi module and the USMt module.
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Patent Agency Ranking
公开(公告)号：US20210119361A1
公开(公告)日：2021-04-22
申请号：US17134098
申请日：2020-12-24
Applicant: Intel Corporation
Inventor： Richard S. PERRY , Robert SCHUM
IPC: H01R12/71 , H01R12/70 , H01R13/6595 , H01R13/6581
Abstract: A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while aligned in substantially the same plane with an inline connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.
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公开(公告)号：US20240413553A1
公开(公告)日：2024-12-12
申请号：US18812418
申请日：2024-08-22
Applicant: Intel Corporation
Inventor： Richard S. PERRY , Robert SCHUM
Abstract: A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while one board is vertically offset from the other board with a top mount connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The lead frame includes leads that have contact arms that are vertically offset from each other. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.
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公开(公告)号：US20220408561A1
公开(公告)日：2022-12-22
申请号：US17894032
申请日：2022-08-23
Applicant: Intel Corporation
Inventor： Tomer SAVARIEGO , Richard S. PERRY , Oren HUBER , Venkataramani GOPALAKRISHNAN
IPC: H05K1/11 , H01L23/498 , H05K3/34 , H01L21/48
Abstract: A novel method and interface are provided to generalize power delivery (PD) solutions and allow OEMs and suppliers to easily replace PD solutions using the same design and layout without having to re-spin the motherboard. This is achieved by defining a new interface and ball-out which support dual port PD solution that meet the system requirements. The embodiments employ an interposer to unify different PD solutions. The interposer is part of a unique Land Grid Array (LGA) soldered down solution with pre-defined interface employing a generic pinout to support PD solutions for dual type-C ports from different vendors. The interposer includes an LGA having a pattern of pads that is coupled to a LGA on a platform PCB with a matching pattern.
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公开(公告)号：US20220077609A1
公开(公告)日：2022-03-10
申请号：US17479596
申请日：2021-09-20
Applicant: Intel Corporation
Inventor： Navneet Kumar SINGH , Aiswarya M. PIOUS , Richard S. PERRY , Amarjeet KUMAR , Siva Prasad JANGILI GANGA , Gaurav HADA , Sushil PADMANABHAN , Konika GANGULY
Abstract: A connector to connect an electronic module to an edge of a first electronic circuit board is described. The module has a second electronic circuit board. The connector has a top part that houses a first row of I/Os. The top part is to be placed on a surface of the first electronic circuit board. The connector has a bottom part that houses a second row of I/Os. The bottom part is to be placed on an opposite surface of the first electronic circuit board, wherein, the top and bottom parts form inner and outer stand-offs when mater together. The inner stand-off is to reside within a through hole of the first electronic circuit board. The outer stand-off is to reside within free space off the edge of the first electronic circuit board. The second electronic circuit board is to be pressed in between the first row of I/Os and the second row of I/Os when the module is connected to the connector.
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公开(公告)号：US20210119363A1
公开(公告)日：2021-04-22
申请号：US17134099
申请日：2020-12-24
Applicant: Intel Corporation
Inventor： Richard S. PERRY , Robert SCHUM
Abstract: A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while one board is vertically offset from the other board with a top mount connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The lead frame includes leads that have contact arms that are vertically offset from each other. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.
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