公开(公告)号：US20200043894A1

公开(公告)日：2020-02-06

申请号：US16051065

申请日：2018-07-31

Applicant: Intel Corporation

Inventor： George VAKANAS ,  Aastha UPPAL ,  Shereen ELHALAWATY ,  Aaron MCCANN ,  Edvin CETEGEN ,  Tannaz HARIRCHIAN ,  Saikumar JAYARAMAN

IPC: H01L25/065 ,  H01L27/108 ,  H01L23/00 ,  H01L23/367 ,  H01L23/373

Abstract: Embodiments disclosed herein include an electronics package and methods of forming such electronics packages. In an embodiment, the electronics package comprises a package substrate, and a first die coupled to the package substrate. In an embodiment, a cavity is formed through the package substrate. In an embodiment, the cavity is within a footprint of the first die. In an embodiment, the electronics package further comprises a thermal stack in the cavity. In an embodiment, the thermal stack contacts the first die.