公开(公告)号：US11464139B2

公开(公告)日：2022-10-04

申请号：US16180499

申请日：2018-11-05

Applicant: Intel Corporation

Inventor： Kelly Lofgreen ,  Joseph Petrini ,  Todd Coons ,  Christopher Wade Ackerman ,  Edvin Cetegen ,  Yang Jiao ,  Michael Rutigliano ,  Kuang Liu

IPC: H05K7/20

Abstract: A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.