公开(公告)号：US20130105087A1

公开(公告)日：2013-05-02

申请号：US13666917

申请日：2012-11-01

申请人： Intevac, Inc.

发明人： Young Kyu Cho ,  Karthik Janakiraman ,  Terry Bluck ,  Diwakar Kedlaya

IPC分类号： H02N13/00 ,  H01L31/18

CPC分类号： H02N13/00 ,  H01J2237/16 ,  H01L21/6833 ,  H01L31/18 ,  Y10T29/49117

摘要： An electrostatic chuck is disclosed, which is especially suitable for fabrication of substrates at high throughput. The disclosed chuck may be used for fabricating large substrates or several smaller substrates simultaneously. For example, disclosed embodiments can be used for fabrication of multiple solar cells simultaneously, providing high throughput. An electrostatic chuck body is constructed using aluminum body having sufficient thermal mass to control temperature rise of the chuck, and anodizing the top surface of the body. A ceramic frame is provided around the chuck's body to protect it from plasma corrosion. If needed, conductive contacts are provided to apply voltage bias to the wafer. The contacts are exposed through the anodization.

摘要翻译： 公开了一种静电卡盘，其特别适用于以高产量制造基板。 所公开的卡盘可以用于同时制造大的基板或几个较小的基板。 例如，所公开的实施例可以同时用于制造多个太阳能电池，从而提供高通量。 使用具有足够热质量的铝体来控制卡盘的温度升高并且阳极氧化主体的顶表面构成静电卡盘体​​。 在卡盘的主体周围设置陶瓷框架，以防止其等离子体腐蚀。 如果需要，提供导电触点以向晶片施加电压偏压。 触点通过阳极氧化暴露。

公开(公告)号：US20130109189A1

公开(公告)日：2013-05-02

申请号：US13666869

申请日：2012-11-01

申请人： Intevac, Inc.

发明人： Young Kyu Cho ,  Karthik Janakiraman ,  Terry Bluck ,  Diwakar Kedlaya

IPC分类号： H01L21/3065

CPC分类号： H01L31/18

摘要： A system for plasma processing of wafers at high throughput, particularly suitable for processing solar cells. A loading station has a loading conveyor, a loading transport mechanism, and a chuck loading station accepting transportable electrostatic chucks, wherein the loading transport mechanism is configured to remove wafers from the conveyor and place them on the transportable electrostatic chucks. The transportable chuck is delivered to at least one processing chamber to perform plasma processing of wafers. An unloading station has an unloading conveyor, an unloading transport mechanism, and a chuck unloading station accepting the transportable electrostatic chucks from the processing chamber, wherein the unloading transport mechanism is configured to remove wafers from the transportable electrostatic chucks and place them on the conveyor. A chuck return module configured for transporting the transportable electrostatic chucks from the chuck unloading station to the chuck loading station.

摘要翻译： 用于高通量处理晶片的系统，特别适用于处理太阳能电池。 装载站具有装载传送装置，装载传送机构和接受可移动静电卡盘的卡盘装载站，其中装载传送机构被配置为从输送机移除晶片并将它们放置在可运输的静电卡盘上。 可移动卡盘被输送到至少一个处理室以执行晶片的等离子体处理。 卸载站具有卸载输送机，卸载输送机构和从处理室接受可运输的静电卡盘的卡盘卸载站，其中卸载输送机构构造成从可移动静电卡盘中移除晶片并将其放置在输送机上。 卡盘返回模块，其构造成将可移动静电卡盘从卡盘卸载站运送到卡盘装载站。