INDUCTIVE/CAPACITIVE HYBRID PLASMA SOURCE AND SYSTEM WITH SUCH CHAMBER
    1.
    发明申请
    INDUCTIVE/CAPACITIVE HYBRID PLASMA SOURCE AND SYSTEM WITH SUCH CHAMBER 有权
    电感/电容混合等离子体源和具有这种室的系统

    公开(公告)号:US20130087531A1

    公开(公告)日:2013-04-11

    申请号:US13644620

    申请日:2012-10-04

    申请人: Intevac, Inc.

    IPC分类号: H05H1/24 B44C1/22 C23F1/08

    CPC分类号: H01J37/32091 H01J37/321

    摘要: A plasma processing chamber having capacitive and inductive coupling of RF power. An RF power source is connected to an inductive coil and to a top electrode via a variable capacitor to control the ratio of power applied to the coil and electrode. The bottom electrode, which is part of the chuck holding the substrates, is floating, but has parasitive capacitance coupling to ground. No RF bias is applied to the chuck and/or the substrate, but the substrate is chucked using DC power. In a system utilizing the chamber, the chuck is movable and is loaded with substrates outside the chamber, enter the chamber from one side for processing, exit the chamber from an opposite side after the processing, and is unloaded in an unloading chamber. The chuck is then transported back to the loading chamber. Substrates are delivered to and removed from the system using conveyor belts.

    摘要翻译: 一种具有RF功率的电容和电感耦合的等离子体处理室。 RF电源通过可变电容器连接到感应线圈和顶部电极,以控制施加到线圈和电极的功率比。 作为夹持基板的卡盘的一部分的底部电极是浮动的,但具有耦合到地的寄生电容。 没有将RF偏压施加到卡盘和/或基板上,而是使用DC电源夹住基板。 在使用该腔室的系统中,卡盘可移动并且在室外装载基底,从一侧进入腔室进行处理,在处理之后从相对侧离开腔室,并在卸载室中卸载。 卡盘然后被运回到装载室。 使用传送带将基板输送到系统并从系统中移出。

    Inductive/capacitive hybrid plasma source and system with such chamber
    2.
    发明授权
    Inductive/capacitive hybrid plasma source and system with such chamber 有权
    电感/电容混合等离子体源和具有这种室的系统

    公开(公告)号:US09034143B2

    公开(公告)日:2015-05-19

    申请号:US13644620

    申请日:2012-10-04

    申请人: INTEVAC, INC.

    CPC分类号: H01J37/32091 H01J37/321

    摘要: A plasma processing chamber having capacitive and inductive coupling of RF power. An RF power source is connected to an inductive coil and to a top electrode via a variable capacitor to control the ratio of power applied to the coil and electrode. The bottom electrode, which is part of the chuck holding the substrates, is floating, but has parasitive capacitance coupling to ground. No RF bias is applied to the chuck and/or the substrate, but the substrate is chucked using DC power. In a system utilizing the chamber, the chuck is movable and is loaded with substrates outside the chamber, enter the chamber from one side for processing, exit the chamber from an opposite side after the processing, and is unloaded in an unloading chamber. The chuck is then transported back to the loading chamber. Substrates are delivered to and removed from the system using conveyor belts.

    摘要翻译: 一种具有RF功率的电容和电感耦合的等离子体处理室。 RF电源通过可变电容器连接到感应线圈和顶部电极,以控制施加到线圈和电极的功率比。 作为夹持基板的卡盘的一部分的底部电极是浮动的,但具有耦合到地的寄生电容。 没有将RF偏压施加到卡盘和/或基板上,而是使用DC电源夹住基板。 在使用该腔室的系统中,卡盘可移动并且在室外装载基底,从一侧进入腔室进行处理,在加工后从相对侧离开腔室,并在卸载室中卸载。 卡盘然后被运回到装载室。 使用传送带将基板输送到系统并从系统中移出。

    SYSTEM ARCHITECTURE FOR PLASMA PROCESSING SOLAR WAFERS
    3.
    发明申请
    SYSTEM ARCHITECTURE FOR PLASMA PROCESSING SOLAR WAFERS 审中-公开
    等离子体处理太阳能波束的系统架构

    公开(公告)号:US20130109189A1

    公开(公告)日:2013-05-02

    申请号:US13666869

    申请日:2012-11-01

    申请人: Intevac, Inc.

    IPC分类号: H01L21/3065

    CPC分类号: H01L31/18

    摘要: A system for plasma processing of wafers at high throughput, particularly suitable for processing solar cells. A loading station has a loading conveyor, a loading transport mechanism, and a chuck loading station accepting transportable electrostatic chucks, wherein the loading transport mechanism is configured to remove wafers from the conveyor and place them on the transportable electrostatic chucks. The transportable chuck is delivered to at least one processing chamber to perform plasma processing of wafers. An unloading station has an unloading conveyor, an unloading transport mechanism, and a chuck unloading station accepting the transportable electrostatic chucks from the processing chamber, wherein the unloading transport mechanism is configured to remove wafers from the transportable electrostatic chucks and place them on the conveyor. A chuck return module configured for transporting the transportable electrostatic chucks from the chuck unloading station to the chuck loading station.

    摘要翻译: 用于高通量处理晶片的系统,特别适用于处理太阳能电池。 装载站具有装载传送装置,装载传送机构和接受可移动静电卡盘的卡盘装载站,其中装载传送机构被配置为从输送机移除晶片并将它们放置在可运输的静电卡盘上。 可移动卡盘被输送到至少一个处理室以执行晶片的等离子体处理。 卸载站具有卸载输送机,卸载输送机构和从处理室接受可运输的静电卡盘的卡盘卸载站,其中卸载输送机构构造成从可移动静电卡盘中移除晶片并将其放置在输送机上。 卡盘返回模块,其构造成将可移动静电卡盘从卡盘卸载站运送到卡盘装载站。

    SOLAR WAFER ELECTROSTATIC CHUCK
    4.
    发明申请
    SOLAR WAFER ELECTROSTATIC CHUCK 审中-公开
    太阳能电熨斗

    公开(公告)号:US20130105087A1

    公开(公告)日:2013-05-02

    申请号:US13666917

    申请日:2012-11-01

    申请人: Intevac, Inc.

    IPC分类号: H02N13/00 H01L31/18

    摘要: An electrostatic chuck is disclosed, which is especially suitable for fabrication of substrates at high throughput. The disclosed chuck may be used for fabricating large substrates or several smaller substrates simultaneously. For example, disclosed embodiments can be used for fabrication of multiple solar cells simultaneously, providing high throughput. An electrostatic chuck body is constructed using aluminum body having sufficient thermal mass to control temperature rise of the chuck, and anodizing the top surface of the body. A ceramic frame is provided around the chuck's body to protect it from plasma corrosion. If needed, conductive contacts are provided to apply voltage bias to the wafer. The contacts are exposed through the anodization.

    摘要翻译: 公开了一种静电卡盘,其特别适用于以高产量制造基板。 所公开的卡盘可以用于同时制造大的基板或几个较小的基板。 例如,所公开的实施例可以同时用于制造多个太阳能电池,从而提供高通量。 使用具有足够热质量的铝体来控制卡盘的温度升高并且阳极氧化主体的顶表面构成静电卡盘体​​。 在卡盘的主体周围设置陶瓷框架,以防止其等离子体腐蚀。 如果需要,提供导电触点以向晶片施加电压偏压。 触点通过阳极氧化暴露。