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102 条记录 (耗时 0.027 秒)

    SYSTEM AND METHOD FOR MAKING THICK-MULTILAYER DIELECTRIC FILMS
    2.
    发明公开
    SYSTEM AND METHOD FOR MAKING THICK-MULTILAYER DIELECTRIC FILMS 审中-公开

    公开(公告)号：US20230274920A1

    公开(公告)日：2023-08-31

    申请号：US18110269

    申请日：2023-02-15

    申请人： INTEVAC, INC.

    发明人： Terry Bluck ,  Samuel D. Harkness, IV ,  Tom Nolan

    IPC分类号： H01J37/34 ,  H01J37/32

    CPC分类号： H01J37/3405 ,  H01J37/3452 ,  H01J37/32761 ,  H01J37/3244 ,  H01J37/32623

    摘要： A linear processing system having an entry loadlock, a first multi-pass processing chamber coupled to the entry loadlock, the first multi-pass processing chamber having a sputtering magnetron arrangement and configured to house a single substrate carrier for performing a multi-pass processing; a single-pass chamber coupled to the first multi-pass processing chamber and having a plurality of magnetron arrangements arranged along a carrier travel direction, the single-pass chamber configured to house multiple carriers arranged serially in a row and configured for a single-pass processing; a second multi-pass processing chamber coupled to the single-pass processing chamber, the second multi-pass processing chamber having a sputtering magnetron arrangement and configured to house a single substrate carrier for performing a multi-pass processing; and an exit loadlock chamber coupled to the second multi-pass processing chamber.

    System with dual-motion substrate carriers
    3.
    发明授权
    System with dual-motion substrate carriers 有权

    公开(公告)号：US11414748B2

    公开(公告)日：2022-08-16

    申请号：US16583165

    申请日：2019-09-25

    申请人： Intevac, Inc.

    发明人： Terry Bluck

    IPC分类号： H01L21/677 ,  C23C14/56 ,  C23C14/34 ,  C23C14/50 ,  H01L21/67

    摘要： A processing system is provided, including a vacuum enclosure having a plurality of process windows and a continuous track positioned therein; a plurality of processing chambers attached sidewalls of the vacuum enclosures, each processing chamber about one of the process windows; a loadlock attached at one end of the vacuum enclosure and having a loading track positioned therein; at least one gate valve separating the loadlock from the vacuum enclosure; a plurality of substrate carriers configured to travel on the continuous track and the loading track; at least one track exchanger positioned within the vacuum enclosure, the track exchangers movable between a first position, wherein substrate carriers are made to continuously move on the continuous track, and a second position wherein the substrate carriers are made to transfer between the continuous track and the loading track.

    MULTI-COLORED DIELECTRIC COATING
    4.
    发明申请
    MULTI-COLORED DIELECTRIC COATING 审中-公开

    公开(公告)号：US20190383976A1

    公开(公告)日：2019-12-19

    申请号：US16281013

    申请日：2019-02-20

    申请人： Intevac, Inc.

    发明人： Terry Bluck ,  Paul Ramon Markoff Johnson ,  Alexander Vassilievich Demchuk

    IPC分类号： G02B5/08 ,  H04M1/02

    摘要： A multi-color dielectric coating is formed using interleaved layers of dielectric material, having alternating refractive index, to create reflections at selected wavelengths, thus appearing as different colors. Etching of selected layers at selected locations changes the color appearance of the etched locations, thus generating a coating having multiple colors. The thicknesses of the layers are chosen such that the path-length differences for reflections from different high-index layers are integer multiples of the wavelength for which the coating is designed.

    System architecture for vacuum processing
    5.
    发明授权
    System architecture for vacuum processing 有权

    公开(公告)号：US10115617B2

    公开(公告)日：2018-10-30

    申请号：US15284450

    申请日：2016-10-03

    申请人： Intevac, Inc.

    发明人： Terry Bluck ,  Vinay Shah ,  Alexandru Riposan

    IPC分类号： H01L21/677 ,  H01L21/67 ,  H01L21/687

    摘要： A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. Loading and unloading of substrates may be performed at one side of the system, or loading can be done at the entry side and unloading at the exit side.

    Implant masking and alignment system with rollers
    9.
    发明授权
    Implant masking and alignment system with rollers 有权
    植入物遮蔽和对齐系统与滚筒

    公开(公告)号：US09543114B2

    公开(公告)日：2017-01-10

    申请号：US14819402

    申请日：2015-08-05

    申请人： Intevac, Inc.

    发明人： Babak Adibi ,  Vinay Prabhakar ,  Terry Bluck

    IPC分类号： G01N23/00 ,  H01J37/20 ,  H01J37/18 ,  H01J37/317

    CPC分类号： H01J37/20 ,  H01J37/185 ,  H01J37/3045 ,  H01J37/3171 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/204 ,  H01J2237/31701 ,  H01J2237/31711

    摘要： System and method to align a substrate under a shadow mask. A substrate holder has alignment mechanism, such as rollers, that is made to abut against an alignment straight edge. The substrate is then aligned with respect to the straight edge and is chucked to the substrate holder. The substrate holder is then transported into a vacuum processing chamber, wherein it is made to abut against a mask straight edge to which the shadow mask is attached and aligned to. Since the substrate was aligned to an alignment straight edge, and since the mask is aligned to the mask straight edge that is precisely aligned to the alignment straight edge, the substrate is perfectly aligned to the mask.

    摘要翻译： 将底物对准荫罩的系统和方法。 衬底保持器具有对准机构，例如辊，其抵靠对准直边缘。 然后将衬底相对于直边对准，并被夹持到衬底保持器。 然后将衬底保持器输送到真空处理室中，其中它与邻接荫罩直线边缘抵接，荫罩直线边缘与阴罩对准。 由于衬底与对准直边对准，并且由于掩模与精确地对准直线对准的掩模直边对准，所以基板与掩模完全对准。