公开(公告)号：US20150295009A1

公开(公告)日：2015-10-15

申请号：US14338327

申请日：2014-07-22

Applicant: Invensas Corporation

Inventor： Liang Wang ,  Eric Tosaya

IPC: H01L27/15 ,  G01R31/26 ,  H01L23/16 ,  H01L21/768 ,  H01L23/48

CPC classification number: H01L33/62 ,  G01R31/2635 ,  H01L22/14 ,  H01L22/32 ,  H01L23/481 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/385 ,  H01L33/405 ,  H01L2224/81

Abstract: Disclosed herein are technologies for forming a plurality of known good die (KGD)—light emitting diode (LED) components into a larger size optically coherent LED chips or devices. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims

Abstract translation: 本文公开了用于将多个已知的良好裸片（KGD）光发射二极管（LED）组件形成为更大尺寸的光学相干LED芯片或器件的技术。 提交本摘要的理解是，它不会用于解释或限制权利要求的范围或含义

公开(公告)号：US10008652B2

公开(公告)日：2018-06-26

申请号：US15469518

申请日：2017-03-25

Applicant: Invensas Corporation

Inventor： Liang Wang ,  Eric Tosaya

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L21/66 ,  H01L33/40 ,  G01R31/26

CPC classification number: H01L33/62 ,  G01R31/2635 ,  H01L22/14 ,  H01L22/32 ,  H01L23/481 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/385 ,  H01L33/405 ,  H01L2224/81

Abstract: Disclosed herein are technologies for forming a plurality of known good die (KGD)-light emitting diode (LED) components into a larger size optically coherent LED chips or devices. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

公开(公告)号：US20170200877A1

公开(公告)日：2017-07-13

申请号：US15469518

申请日：2017-03-25

Applicant: Invensas Corporation

Inventor： Liang Wang ,  Eric Tosaya

IPC: H01L33/62 ,  G01R31/26 ,  H01L21/66 ,  H01L33/40 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L33/62 ,  G01R31/2635 ,  H01L22/14 ,  H01L22/32 ,  H01L23/481 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/385 ,  H01L33/405 ,  H01L2224/81

Abstract: Disclosed herein are technologies for forming a plurality of known good die (KGD)-light emitting diode (LED) components into a larger size optically coherent LED chips or devices. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims

公开(公告)号：US09620436B2

公开(公告)日：2017-04-11

申请号：US14338327

申请日：2014-07-22

Applicant: Invensas Corporation

Inventor： Liang Wang ,  Eric Tosaya

IPC: H01L33/00 ,  H01L23/48 ,  H01L23/00 ,  G01R31/26 ,  H01L25/075

CPC classification number: H01L33/62 ,  G01R31/2635 ,  H01L22/14 ,  H01L22/32 ,  H01L23/481 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/385 ,  H01L33/405 ,  H01L2224/81

Abstract: Disclosed herein are technologies for forming a plurality of known good die (KGD)-light emitting diode (LED) components into a larger size optically coherent LED chips or devices. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.