公开(公告)号：US10529635B2

公开(公告)日：2020-01-07

申请号：US15493231

申请日：2017-04-21

Applicant: J-DEVICES CORPORATION

Inventor： Hisakazu Marutani ,  Minoru Kai ,  Kazuhiko Kitano

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/82 ,  H01L23/544 ,  H01L23/00

Abstract: A manufacturing method of a semiconductor package includes locating a plurality of semiconductor packages on a substrate, forming a resin insulating layer covering the plurality of semiconductor devices, forming grooves, in the resin insulating layer, enclosing each of the plurality of semiconductor devices and reaching the substrate, and irradiating the substrate with laser light in positional correspondence with the grooves to separate the plurality of semiconductor devices from each other.

公开(公告)号：US10388625B2

公开(公告)日：2019-08-20

申请号：US15290557

申请日：2016-10-11

Applicant: J-DEVICES CORPORATION

Inventor： Minoru Kai

IPC: H01L21/68 ,  H01L21/67 ,  H01L23/00

Abstract: A press fitting head comprising an elastic member in a part where the press fitting head contacts a semiconductor device, and an alignment mark recognition area capable of detecting an optically readable marker provided on a surface to be contacted to the semiconductor device is provided. Additionally, a semiconductor manufacturing apparatus in which the press fitting head is applied is provided.

公开(公告)号：US10157760B2

公开(公告)日：2018-12-18

申请号：US15600082

申请日：2017-05-19

Applicant: J-DEVICES CORPORATION

Inventor： Minoru Kai

IPC: H01L21/68 ,  H01L21/67 ,  H01L23/14 ,  H01L23/498 ,  H01L23/00 ,  H01L21/683

Abstract: A semiconductor manufacturing apparatus comprises a stage connected to a vacuum generator to suction a semiconductor wafer including a plurality of semiconductor chips, a suction control unit connected to a connecting portion of the stage and the vacuum generator to control the connection of the stage and the vacuum generator, a pickup unit connected to a movement control unit simultaneously picking up the plurality of semiconductor chips, and a control unit controlling movement and rotation of the pickup unit and controlling the suction control unit, the control unit is connected to the movement control unit. The pickup unit converts an interval of the plurality of semiconductor chips to a predetermined pitch and holds the pitch. The pickup unit moves the plurality of semiconductor chips from the stage to mounting positions of a supporting substrate and simultaneously adheres the plurality of semiconductor chips at the mounting positions by the control unit.