Abstract:
A primer composition and method for improving adhesion of polymeric material to metal ion containing substrate is provided. The primer consists of a solution of a polymer whose chain contains polar groups, such as carboxy, hydroxy, groups and the like, and non-polar monoethylenically unsaturated terminal groups. The primer is applied to the surface to be treated, the solvent evaporated and the polymeric material applied and cured in the usual way. The bond tensile strength of samples employing the primer composition is substantially increased as compared to the bond tensile strength of samples not employing the primer composition of this invention.