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    Electrically conductive adhesive
    3.
    发明授权
    Electrically conductive adhesive 有权

    公开(公告)号：US11802221B2

    公开(公告)日：2023-10-31

    申请号：US17495409

    申请日：2021-10-06

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jing Fang ,  Dong Yang ,  Jeffrey W. McCutcheon

    IPC: H01B1/22 ,  C09J9/02 ,  C09J201/02

    CPC classification number: C09J9/02 ,  C09J201/02 ,  H01B1/22 ,  C09J2301/302 ,  C09J2301/312 ,  C09J2301/314

    Abstract: An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive dendritic first particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 20 micrometers to about 40 micrometers; and a plurality of electrically conductive substantially planar second particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 40 micrometers to about 70 micrometers. The adhesive layer has an average thickness in a range from about 15 micrometers to about 35 micrometers, an electrical resistance in a thickness direction of less than about 30 milliohms, and a peel strength of at least 0.1 N/mm from a stainless steel surface after a dwell time of about 20 minutes at 22° C.

    SHEET FOR SEMICONDUCTOR-RELATED-MEMBER PROCESSING AND METHOD OF MANUFACTURING CHIPS USING THE SHEET
    5.
    发明申请
    SHEET FOR SEMICONDUCTOR-RELATED-MEMBER PROCESSING AND METHOD OF MANUFACTURING CHIPS USING THE SHEET 有权
    半导体相关会员处理的表格及使用该片的制造方法

    公开(公告)号：US20160372358A1

    公开(公告)日：2016-12-22

    申请号：US15122195

    申请日：2015-03-02

    Applicant: LINTEC CORPORATION

    Inventor： Yosuke KOMA ,  Takuo NISHIDA ,  Misaki SAKAMOTO

    IPC: H01L21/683 ,  C09J5/06 ,  C09J7/02 ,  C09J133/06 ,  H01L21/78 ,  H01L21/324

    CPC classification number: H01L21/6836 ,  C08F220/06 ,  C09J4/00 ,  C09J4/06 ,  C09J5/00 ,  C09J5/06 ,  C09J7/22 ,  C09J7/38 ,  C09J7/385 ,  C09J133/06 ,  C09J201/02 ,  C09J2201/122 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  H01L21/324 ,  H01L21/78 ,  H01L2221/68322 ,  H01L2221/68327

    Abstract: As a semiconductor-related-member processing sheet which can stably achieve to enhance the removability of the semiconductor-related-member processing sheet and to suppress the reliability degradation of members comprising chips manufactured from a semiconductor-related member using the semiconductor-related-member processing sheet, there is provided a semiconductor-related-member processing sheet, comprising a base material and a pressure sensitive adhesive layer provided on or above one surface of the base material, wherein the pressure sensitive adhesive layer comprises one or more types of energy ray polymerizable compounds having an energy ray polymerizable functional group, wherein at least one type of the energy ray polymerizable compounds is a polymerizable branched polymer that is a polymer having a branched structure, wherein a contact angle on a measurement target surface is 40° or less when measured using a water droplet under an environment of 25° C. and a relative humidity of 50%.

    Abstract translation: 作为能够稳定地实现半导体相关部件处理片的可去除性的半导体相关部件处理片，并且使用半导体相关部件抑制由包括由半导体相关部件制造的芯片的部件的可靠性劣化 提供了一种半导体相关件处理片，其包括基材和设置在基材的一个表面上或之上的压敏粘合剂层，其中该压敏粘合剂层包含一种或多种类型的能量射线 具有能量射线聚合性官能团的可聚合化合物，其中至少一种类型的能量射线可聚合化合物是作为具有支化结构的聚合物的可聚合支化聚合物，其中测量目标表面上的接触角为40°以下， 在25℃的环境和相对湿度下使用水滴测量 50％。

    COMPOSITION, APPARATUS, KIT AND METHOD AND USES THEREOF
    7.
    发明申请
    COMPOSITION, APPARATUS, KIT AND METHOD AND USES THEREOF 审中-公开
    组合物，装置，套件及其方法及其用途

    公开(公告)号：US20150159066A1

    公开(公告)日：2015-06-11

    申请号：US14360591

    申请日：2011-11-26

    Applicant: Smith & Nephew PLC

    Inventor： Edward Yerbury Hartwell ,  Christopher John Fryer ,  Sarah Jenny Collinson ,  Marcus Damian Phillips

    IPC: C09J183/00 ,  A61M5/19 ,  C09J201/02 ,  A61M1/00

    CPC classification number: C09J183/00 ,  A61F13/00063 ,  A61F13/00068 ,  A61F13/0216 ,  A61F17/00 ,  A61L15/225 ,  A61L15/42 ,  A61L15/585 ,  A61M1/0088 ,  A61M5/19 ,  C09J201/02 ,  C08L83/04

    Abstract: A curable composition for use in wound care comprising, apportioned between at least one Part A and at least one Part B: one or more alkenyl-group containing polymers (i) having at least one alkenyl group or moiety per molecule, one or more SiH-containing polymers (ii) having at least one Si—H unit per molecule; and a catalyst (iii) for curing by addition of alkenyl-containing polymer (i) to SiH-containing polymer (ii), Part A and Part B independently having viscosity at 23° C. in the range 5-300 Pa·s, preferably 10-100 Pa s, at a shearing rate of 10 s−1, and when combined in one Part having cure time at 23° C. in the range from 0.5 min to 25 min, wherein when dispensed into a location about a wound dressing, said wound dressing overlying a wound site and skin thereabout, said dispensing being so as to intimately contact and overlie an edge of said dressing and skin about said edge, the composition cures in contact with said edge and skin at 32° C. to an elastomer exhibiting zero or low tack at a time in the range from 0.5 to less than 30 minutes, apparatus for use with said composition comprising dispensing apparatus or wound dressing, a kit comprising the same, and methods of dispensing and curing the same and of using the same in sealing a wound dressing and in treating a wound site of a human in need thereof.

    Abstract translation: 一种用于伤口护理的可固化组合物，包括在至少一份A部分和至少一份B部分之间分配：一种或多种含烯基基团的聚合物（i）每分子具有至少一个烯基或部分，一个或多个SiH （ii）每分子具有至少一个Si-H单元; 和含有烯基的聚合物（i）通过向含有SiH的聚合物（ii），A部分和B部分独立地在23℃下具有在5-300Pa·s范围内的粘度进行固化的催化剂（iii） 优选10-100Pa s，剪切速率为10s -1，当在一个部分中组合时，其固化时间为23℃，范围为0.5分钟至25分钟，其中当分配到围绕伤口的位置时 所述敷料覆盖伤口部位和皮肤周围的所述伤口敷料，所述分配物以便围绕所述边缘紧密地接触和覆盖所述敷料和皮肤的边缘，所述组合物在32℃下与所述边缘和皮肤接触固化， 在0.5至小于30分钟的时间内显示零或低粘性的弹性体，用于所述组合物的装置，包括分配装置或伤口敷料，包含该装置的试剂盒，以及分配和固化该组合物的方法和 使用它来密封伤口敷料和治疗伤口部位o 是有需要的人。

    Bioadhesive compositions
    10.
    发明授权
    Bioadhesive compositions 失效
    生物粘合剂组合物

    公开(公告)号：US06896903B2

    公开(公告)日：2005-05-24

    申请号：US09916880

    申请日：2001-07-27

    Applicant: Hugh Semple Munro ,  Brian John Tighe

    Inventor： Hugh Semple Munro ,  Brian John Tighe

    IPC: A61B5/0408 ,  A61L26/00 ,  C09J11/00 ,  C09J131/06 ,  C09J133/00 ,  C09J133/24 ,  C09J171/00 ,  C09J201/00 ,  C09J201/02 ,  A61K9/14

    CPC classification number: C09J201/02

    Abstract: A bioadhesive composition formed by polymerizing a homogeneous aqueous reaction mixture comprising from about 5% to about 50%, by weight of the reaction mixture, of at least one ionic water soluble monomer, from about 10% to about 50%, by weight of the reaction mixture, of at least one plasticizer (other than water), up to about 50%, by weight of the reaction mixture, of at least one non ionic water soluble monomer, up to about 40%, by weight of the reaction mixture, of water, optionally as well as up to about 10%, by weight of the reaction mixture, of at least one surfactant and from about 1% to about 30%, by weight of the reaction mixture, of at least one hydrophobic monomer and/or polymer. An electrolyte may be present, to enhance electrical conductivity, e.g. for use in biomedical electrodes.

    Abstract translation: 通过聚合包含按重量计约5％至约50％的反应混合物的至少一种离子水溶性单体，约10重量％至约50重量％ 反应混合物，至少一种增塑剂（除水以外），至多约50％重​​量比的反应混合物，至少一种非离子水溶性单体，至多约40重量％的反应混合物， 的水，任选地以及至多约10重量％的反应混合物，至少一种表面活性剂和约1％至约30％重量的反应混合物，至少一种疏水性单体和/ 或聚合物。 可以存在电解质，以增强导电性，例如 用于生物医学电极。

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