公开(公告)号：US20120295288A1

公开(公告)日：2012-11-22

申请号：US13475658

申请日：2012-05-18

申请人： Jau-Song Yu ,  Ya-Ting Chang ,  Chih-Ching Wu ,  Yi-Ming Shyr ,  Yu-Sun Chang

发明人： Jau-Song Yu ,  Ya-Ting Chang ,  Chih-Ching Wu ,  Yi-Ming Shyr ,  Yu-Sun Chang

IPC分类号： G01N33/574 ,  H01J49/26 ,  G01N27/62

CPC分类号： G01N33/57438

摘要： UL16 binding protein 2 (ULBP2) is a protein overexpressed in pancreatic cancer tissues, and the ULBP2 levels are significantly higher in pancreatic cancer patients than those in healthy controls. This invention provides a method to detect pancreatic cancer using ULBP2 as a serological marker. The combination of ULBP2 and CA19-9 promotes the efficacy of pancreatic cancer detection. When measuring the blood ULBP2 levels in patients with other cancer types, including colorectal carcinoma, nasopharyngeal carcinoma and gastric cancer illustrates the blood ULBP2 levels are higher in patients with pancreatic cancer than other cancer types.

摘要翻译： UL16结合蛋白2（ULBP2）是胰腺癌组织中过表达的蛋白质，胰腺癌患者的ULBP2水平明显高于健康对照组。 本发明提供了使用ULBP2作为血清学标记来检测胰腺癌的方法。 ULBP2和CA19-9的组合促进胰腺癌检测的功效。 当测量其他癌症类型（包括结肠直肠癌，鼻咽癌和胃癌）患者的血液ULBP2水平时，说明胰腺癌患者的血液ULBP2水平高于其他癌症类型。

公开(公告)号：US20130232454A1

公开(公告)日：2013-09-05

申请号：US13409515

申请日：2012-03-01

申请人： Chih-Shiang Chou ,  Ya-Ting Chang ,  Fu-Sheng Chu ,  Yu-Po Tang

发明人： Chih-Shiang Chou ,  Ya-Ting Chang ,  Fu-Sheng Chu ,  Yu-Po Tang

IPC分类号： G06F17/50

CPC分类号： G03F1/70 ,  G03F1/36

摘要： Integrated circuit (IC) methods for optical proximity correction (OPC) modeling and mask repair are described. The methods include use of an optical model that generates a simulated aerial image from an actual aerial image obtained in an optical microscope system. In the OPC modeling methods, OPC according to stage modeling is simulated, and OPC features may be added to a design layout according to the simulating OPC. In the mask repair methods, inverse image rendering is performed on the actual aerial image and diffraction image by applying an optical model that divides an incoherent exposure source into a plurality of coherent sources.

摘要翻译： 描述了用于光学邻近校正（OPC）建模和掩模修复的集成电路（IC）方法。 这些方法包括使用从在光学显微镜系统中获得的实际空间图像生成模拟空间图像的光学模型。 在OPC建模方法中，根据阶段建模对OPC进行了仿真，根据模拟OPC可以将OPC特征加入到设计布局中。 在掩模修复方法中，通过应用将非相干曝光源分割为多个相干光源的光学模型，对实际的空间图像和衍射图像执行逆图像渲染。

公开(公告)号：US08572520B2

公开(公告)日：2013-10-29

申请号：US13409515

申请日：2012-03-01

申请人： Chih-Shiang Chou ,  Ya-Ting Chang ,  Fu-Sheng Chu ,  Yu-Po Tang

发明人： Chih-Shiang Chou ,  Ya-Ting Chang ,  Fu-Sheng Chu ,  Yu-Po Tang

IPC分类号： G06F17/50 ,  G06G7/62

CPC分类号： G03F1/70 ,  G03F1/36

摘要： Integrated circuit (IC) methods for optical proximity correction (OPC) modeling and mask repair are described. The methods include use of an optical model that generates a simulated aerial image from an actual aerial image obtained in an optical microscope system. In the OPC modeling methods, OPC according to stage modeling is simulated, and OPC features may be added to a design layout according to the simulating OPC. In the mask repair methods, inverse image rendering is performed on the actual aerial image and diffraction image by applying an optical model that divides an incoherent exposure source into a plurality of coherent sources.

摘要翻译： 描述了用于光学邻近校正（OPC）建模和掩模修复的集成电路（IC）方法。 这些方法包括使用从在光学显微镜系统中获得的实际空间图像生成模拟空间图像的光学模型。 在OPC建模方法中，根据阶段建模对OPC进行了仿真，根据模拟OPC可以将OPC特征加入到设计布局中。 在掩模修复方法中，通过应用将非相干曝光源分割为多个相干光源的光学模型，对实际的空间图像和衍射图像执行逆图像渲染。

公开(公告)号：US20130037934A1

公开(公告)日：2013-02-14

申请号：US13205648

申请日：2011-08-09

申请人： Chih-Ching Lin ,  Ya-Ting Chang ,  Chia-Lin Chuang

发明人： Chih-Ching Lin ,  Ya-Ting Chang ,  Chia-Lin Chuang

IPC分类号： H01L23/48

CPC分类号： H01L23/5286 ,  H01L23/5223 ,  H01L24/05

摘要： An integrated circuit chip includes a power/ground interconnection network in a topmost metal layer over a semiconductor substrate and at least a bump pad on/over the power/ground interconnection network. The power/ground mesh interconnection network includes a first power/ground line connected to the bump pad and extending along a first direction, and a connection portion connected to the bump pad and extending along a second direction.

摘要翻译： 集成电路芯片包括位于半导体衬底上的最顶层金属层中的电源/接地互连网络，以及至少在电力/接地互连网络上/之上的凸块焊盘。 电源/接地网状互连网络包括连接到凸块焊盘并沿着第一方向延伸的第一电源/接地线，以及连接到凸块焊盘并沿第二方向延伸的连接部分。

公开(公告)号：US08772928B2

公开(公告)日：2014-07-08

申请号：US13205648

申请日：2011-08-09

申请人： Chih-Ching Lin ,  Ya-Ting Chang ,  Chia-Lin Chuang

发明人： Chih-Ching Lin ,  Ya-Ting Chang ,  Chia-Lin Chuang

IPC分类号： H01L23/48

CPC分类号： H01L23/5286 ,  H01L23/5223 ,  H01L24/05

摘要： An integrated circuit chip includes a power/ground interconnection network in a topmost metal layer over a semiconductor substrate and at least a bump pad on/over the power/ground interconnection network. The power/ground mesh interconnection network includes a first power/ground line connected to the bump pad and extending along a first direction, and a connection portion connected to the bump pad and extending along a second direction.

摘要翻译： 集成电路芯片包括位于半导体衬底上的最顶层金属层中的电源/接地互连网络，以及至少在电力/接地互连网络上/之上的凸块焊盘。 电源/接地网状互连网络包括连接到凸块焊盘并沿着第一方向延伸的第一电源/接地线，以及连接到凸块焊盘并沿第二方向延伸的连接部分。